How to make a display panel

A manufacturing method and technology for display panels, which are applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as damage to circuits, waste of motherboard materials, and reduction in typesetting utilization.

Active Publication Date: 2020-07-14
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, when manufacturing display panels, the energy of laser lift-off (LLO) cannot be precisely controlled. Therefore, when laser scanning is used, a large sealing area must be reserved for the mother board of the display panel. To avoid damage to the circuit due to laser irradiation errors
When the width of the sealing area is large, it will inevitably cause problems such as waste of motherboard materials, increased costs, reduced production capacity, and reduced layout utilization.

Method used

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  • How to make a display panel
  • How to make a display panel
  • How to make a display panel

Examples

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Embodiment Construction

[0034] The following examples are provided for detailed description, and the examples are only used as examples for illustration, and are not intended to limit the scope of protection of the present invention. The same / similar symbols are used to represent the same / similar components in the following description.

[0035] Please refer to Figure 1A to Figure 1C , the manufacturing method of the display panel 108 according to an embodiment of the present invention includes the following steps. First, please refer to Figure 1A and Figure 1B , forming a motherboard 101 on a carrier 111 , wherein the motherboard 101 is a substrate material for making the display panel 108 and can be used as a flexible substrate. In this embodiment, the motherboard 101 is temporarily formed on the supporting hard carrier 111, and in a subsequent stage, the pixel unit 102, the circuit layer 103 and the protective layer 104 required by the display panel 108 can be fabricated. After completion, t...

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Abstract

The present invention discloses a method for manufacturing a display panel. The method comprises forming a motherboard on a carrier board. The motherboard has a plurality of to-be-cut sections and a sealing area, each to-be-cut section having a display area, and the carrier board having a peel-off area and a guard portion. The peel-off area and the to-be-cut sections of the motherboard are opposite to each other, the guard portion and the sealing area of the motherboard are opposite to each other, and the guard portion overlaps with the sealing area in one direction. Energy is provided from one side of the carrier to cause a change in the interface formed between the carrier and the carrier, and the guard portion prevents the energy from directly entering the sealing area.

Description

technical field [0001] The invention relates to a manufacturing method of a display panel. Background technique [0002] In recent years, with the rapid development of network and communication technologies, the display panels of mobile electronic devices are developing toward flexible display technologies. Since the flexible display panel has the characteristics of being bendable and foldable, smaller in size and easy to carry, it has become the focus of the development of the new generation of display technology. [0003] However, when manufacturing display panels, the energy of laser lift-off (LLO) cannot be precisely controlled. Therefore, when laser scanning is used, a large sealing area must be reserved for the mother board of the display panel. In order to avoid damage to the circuit due to laser irradiation errors. When the width of the sealing area is large, it will inevitably cause problems such as waste of motherboard materials, increased costs, reduced producti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77
Inventor 林昆标
Owner AU OPTRONICS CORP
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