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Test method of pressure sensor chip

A technology of pressure sensor and test method, applied in the direction of force/torque/work measurement instrument calibration/test, measurement of fluid pressure, instruments, etc., can solve problems such as difficulty in confirming process failure

Inactive Publication Date: 2018-01-09
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even when a reliability failure is identified for a MEMS chip, it is more difficult to identify which parameter in the process is responsible for the failure

Method used

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  • Test method of pressure sensor chip
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  • Test method of pressure sensor chip

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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of ...

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Abstract

The invention relates to a test method of a pressure sensor chip. The method comprises steps of under the normal temperature, testing first output voltage of multiple tested pressure sensor chips within a working pressure range; carrying out different aging processing on the tested pressure sensor chips; recovering the tested pressure sensor chips subjected to the aging processing to be in the normal temperature and testing second output voltage within the working pressure range; calculating the actual change rate of the two output voltage of the tested pressure sensor chips; and by comparingthe actual change rate and a preset change rate, precisely judging whether the tested pressure sensor chips are qualified or not. According to the invention, performance of the pressure sensor chips can be directly, rapidly and accurately tested, and the method can be used for verifying and monitoring technique reliability of the pressure sensor chips.

Description

technical field [0001] The invention relates to semiconductor device testing, in particular to a testing method for a pressure sensor chip. Background technique [0002] Micro Electro Mechanical Systems (MEMS) is the use of integrated circuit manufacturing technology and micro-processing technology to manufacture micro-structures, micro-sensors, micro-actuators, control processing circuits, and even interfaces, communications and power supplies on one or more chips. micro-integrated system on [0003] A pressure sensor is a transducer that converts a pressure signal into an electrical signal, and is an important part of a commercial sensor. Compared with traditional pressure sensors, pressure sensors prepared with MEMS technology have obvious advantages in terms of volume, power consumption, weight and price. At present, pressure sensors made with MEMS technology have been widely used in many fields such as automobile industry, biomedicine, industrial control, energy, and ...

Claims

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Application Information

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IPC IPC(8): G01L25/00G01L27/00
Inventor 马婷婷王少荣
Owner CSMC TECH FAB2 CO LTD
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