Electroconductive adhesive with high performance, low resistance value and high cost performance, and preparation method thereof

A conductive adhesive and low-resistance technology, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve problems such as difficult conduction, shielding effect, large resistance value, low-resistance conductive adhesive products, etc.

Inactive Publication Date: 2017-12-12
SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the resistance of traditional conductive adhesives is generally above 10 ohms. When encountering high temperatures, the resistance value will increase, making it difficult to perform conduction and shielding functions, resulting in shortened product life. The problem of the selection problem, has not yet developed a high-performance, low resistance, cost-effective conductive adhesive products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1, a high-performance, low-resistance, high-cost-effective conductive adhesive is made of the following components by mass percentage: 35% epoxy resin, 17% acrylic resin, and 25% conductive adhesive filler (copper and silver in a certain proportion) , dispersant 20%, curing agent 2.7%, curing accelerator 0.3%.

[0020] A method for preparing a high-performance, low-resistance, and cost-effective conductive adhesive, comprising the following steps:

[0021] (1) get each raw material by component mass percentage;

[0022] (2) Mix and stir the epoxy resin, acrylic resin and dispersant evenly, and then slowly add the conductive adhesive filler to the above components;

[0023] (3) Add the curing agent and the curing accelerator to the raw materials prepared in step (2), ensure that they are fully mixed, and then stir at a high speed for 30 minutes to obtain the conductive adhesive.

Embodiment 2

[0024] Embodiment 2, a high-performance, low-resistance, high-cost-effective conductive adhesive is made of the following components by mass percentage: 40% epoxy resin, 15% acrylic resin, and 22% conductive adhesive filler (copper and silver in a certain proportion) , dispersant 19%, curing agent 3.5%, curing accelerator 0.5%.

[0025] A method for preparing a high-performance, low-resistance, and cost-effective conductive adhesive, comprising the following steps:

[0026] (1) get each raw material by component mass percentage;

[0027] (2) Mix and stir the epoxy resin, acrylic resin and dispersant evenly, and then slowly add the conductive adhesive filler to the above components;

[0028] (3) Add the curing agent and the curing accelerator to the raw materials prepared in step (2), ensure that they are fully mixed, and then stir at a high speed for 30 minutes to obtain the conductive adhesive.

Embodiment 3

[0029] Embodiment 3, a high-performance, low-resistance, and cost-effective conductive adhesive is made of the following components in mass percent: 35% epoxy resin, 25% acrylic resin, and 20% conductive adhesive filler (copper and silver in a certain proportion) , dispersant 16%, curing agent 3.5%, curing accelerator 0.5%.

[0030] A method for preparing a high-performance, low-resistance, and cost-effective conductive adhesive, comprising the following steps:

[0031] (1) get each raw material by component mass percentage;

[0032] (2) Mix and stir the epoxy resin, acrylic resin and dispersant evenly, and then slowly add the conductive adhesive filler to the above components;

[0033] (3) Add the curing agent and the curing accelerator to the raw materials prepared in step (2), ensure that they are fully mixed, and then stir at a high speed for 30 minutes to obtain the conductive adhesive.

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Abstract

The invention discloses electroconductive adhesive with high performance, low resistance value and high cost performance, and a preparation method thereof. The electroconductive adhesive is mainly prepared from epoxy resin, acrylic resin, electroconductive adhesive filler, a dispersing agent, a curing agent and a curing accelerant. The preparation method comprises the following steps: mixing and stirring the epoxy resin, the acrylic resin and the dispersing agent uniformly, slowly adding the electroconductive adhesive filler into the components, adding the curing agent and the curing accelerant, guaranteeing complete and uniform mixing, and stirring at high speed and for 20 to 60 minutes to obtain the electroconductive adhesive. The selected epoxy resin and the acrylic resin are compounded and the advantages of the two adhesive systems are combined, so the temperature resistance and the stability of the electroconductive adhesive can be improved greatly, the traditional single metal copper powder is replaced by the silver-plated copper powder compounded with the resin, the cost is reduced, and the electric conductivity and the electroconductive stability are greatly improved.

Description

technical field [0001] The invention discloses a high-performance, low-resistance, high-cost-effective conductive adhesive and a preparation method thereof, which can be applied to telephone and mobile communication systems; broadcasting, television, computer and other industries; automobile industry; medical equipment and the like. Background technique [0002] Conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive particles as the main components. Through the bonding effect of matrix resin, the conductive particles are combined to form a conductive path. conductive connection. Since the matrix resin of the conductive adhesive is an adhesive, the appropriate curing temperature can be selected for bonding. At the same time, with the rapid development of electronic technology, electronic products are gradually developing towards miniaturization and integration. The higher the level of integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J133/02C09J11/04
CPCC09J9/02C08K2003/0806C08K2003/085C08K2201/001C09J11/04C09J163/00C08L33/02C08K9/10C08K3/08
Inventor 邹威张波武天祥王洪浜耿国凌
Owner SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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