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Fine grinding device for preparation of conductive silver adhesives

A technology of fine grinding and conductive silver glue, applied in grain processing, etc., can solve the problems of difficult maintenance and replacement of grinding equipment, easy adhesion of raw materials to grinding tools, insufficient grinding, etc.

Inactive Publication Date: 2017-12-12
谢航洋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the traditional grinding method of raw materials for the preparation of conductive silver glue, the grinding efficiency is low, the grinding is insufficient, the raw materials are easy to adhere to the grinding tools, and the grinding equipment is not easy to repair and replace. The technical problem to be solved by the invention is to provide a A fine grinding device for the preparation of conductive silver glue

Method used

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  • Fine grinding device for preparation of conductive silver adhesives
  • Fine grinding device for preparation of conductive silver adhesives
  • Fine grinding device for preparation of conductive silver adhesives

Examples

Experimental program
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Effect test

Embodiment 1

[0039] A fine grinding device for the preparation of conductive silver glue, such as Figure 1-7 As shown, it includes a grinding tank body 1, a grinding roller 2, a swing rod 3, a push rod 4, a moving device 5, a swinging device 6 and a top plate 7, and the bottom of the top plate 7 is provided with a moving device 5 and a swinging device 6, and the moving device 5 is set On the right side of the swing device 6, a push rod 4 is connected between the moving device 5 and the swing device 6, a grinding tank 1 is arranged below the top plate 7, a swing rod 3 is connected symmetrically on the swing device 6, and the swing rod 3 The end is connected with a grinding roller 2, and the grinding roller 2 is in contact with the inner bottom of the grinding tank body 1.

Embodiment 2

[0041] A fine grinding device for the preparation of conductive silver glue, such as Figure 1-7 As shown, it includes a grinding tank body 1, a grinding roller 2, a swing rod 3, a push rod 4, a moving device 5, a swinging device 6 and a top plate 7, and the bottom of the top plate 7 is provided with a moving device 5 and a swinging device 6, and the moving device 5 is set On the right side of the swing device 6, a push rod 4 is connected between the moving device 5 and the swing device 6, a grinding tank 1 is arranged below the top plate 7, a swing rod 3 is connected symmetrically on the swing device 6, and the swing rod 3 The end is connected with a grinding roller 2, and the grinding roller 2 is in contact with the inner bottom of the grinding tank body 1.

[0042] The moving device 5 includes a left bearing seat 51, a first nut 52, a screw mandrel 53, a first rotating shaft 54, a right bearing seat 55 and a handle 56, and the bottom of the top plate 7 on the right side of ...

Embodiment 3

[0044] A fine grinding device for the preparation of conductive silver glue, such as Figure 1-7 As shown, it includes a grinding tank body 1, a grinding roller 2, a swing rod 3, a push rod 4, a moving device 5, a swinging device 6 and a top plate 7, and the bottom of the top plate 7 is provided with a moving device 5 and a swinging device 6, and the moving device 5 is set On the right side of the swing device 6, a push rod 4 is connected between the moving device 5 and the swing device 6, a grinding tank 1 is arranged below the top plate 7, a swing rod 3 is connected symmetrically on the swing device 6, and the swing rod 3 The end is connected with a grinding roller 2, and the grinding roller 2 is in contact with the inner bottom of the grinding tank body 1.

[0045] The moving device 5 includes a left bearing seat 51, a first nut 52, a screw mandrel 53, a first rotating shaft 54, a right bearing seat 55 and a handle 56, and the bottom of the top plate 7 on the right side of ...

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Abstract

The invention relates to a grinding device, in particular to a fine grinding device for preparing conductive silver glue. The technical problem to be solved by the present invention is to provide a fine grinding device for the preparation of conductive silver glue. In order to solve the above technical problems, the present invention provides such a fine grinding device for the preparation of conductive silver glue, which includes a grinding tank, a grinding roller, a swing rod, a push rod, a moving device, etc.; the bottom of the top plate is provided with a moving device and a swinging device , the moving device is set on the right side of the swinging device, a push rod is connected between the moving device and the swinging device, a grinding tank is set under the top plate, a swinging rod is symmetrically connected to the swinging device, and a grinding roller is connected to the end of the swinging rod . The invention achieves thorough grinding of the raw materials for the preparation of the conductive silver glue, high grinding efficiency, sufficient and fine grinding, full utilization of the raw materials, and prevention of the adhesion of the raw materials for the preparation of the conductive silver glue to the inner wall of the grinding tank.

Description

technical field [0001] The invention relates to a grinding device, in particular to a fine grinding device for preparing conductive silver glue. Background technique [0002] The matrix resin of the conductive silver adhesive is an adhesive, which can be bonded at an appropriate curing temperature. For example, the epoxy resin adhesive can be cured at room temperature to 150°C, which is much lower than the soldering temperature above 200°C for tin-lead soldering. temperature, which avoids material deformation, thermal damage of electronic devices and formation of internal stress that may be caused by high temperature welding. Conductive silver paste can be made into paste to achieve high line resolution. Moreover, the conductive silver glue has a simple process and is easy to operate, which can improve production efficiency and avoid environmental pollution caused by heavy metal lead in tin-lead solder. Therefore, conductive silver glue is an ideal choice to replace lead-t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C4/02B02C4/42
CPCB02C4/02B02C4/423
Inventor 谢航洋
Owner 谢航洋
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