Semiconductor device and motor apparatus

A semiconductor and motor technology, applied in semiconductor devices, electromechanical devices, semiconductor/solid device components, etc., can solve problems such as short circuits between IC chips and heat sinks

Inactive Publication Date: 2017-11-28
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the above-mentioned various inconsistencies are considered, if the above-mentioned gap is too small, the faces of the IC chip and the heat sink facing each other will be the closest to the greatest extent, and the heat-dissipating grease between the facing faces will flow. case, there is a possibility of a short circuit between the IC chip and the heat sink
In addition, such problems also exist in the semiconductor devices used other than the controller of the motor device.

Method used

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  • Semiconductor device and motor apparatus
  • Semiconductor device and motor apparatus
  • Semiconductor device and motor apparatus

Examples

Experimental program
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Embodiment Construction

[0023] Hereinafter, a semiconductor device and a motor device according to an embodiment of the present invention will be described. Such as figure 1 As shown, the motor device 10 of this embodiment comprises a motor 20 having a motor shaft, a rotor, a stator, etc., and a semiconductor device (hereinafter referred to as a controller) such as an inverter circuit for driving and controlling the rotation of the motor 20. 30 is integrally formed as a motor unit with a drive control circuit. In addition, the motor device 10 of the present embodiment is mounted, for example, in an electric power steering device of a vehicle. The electric power steering assists a user's steering operation by controlling the motor device 10 .

[0024] The motor device 10 includes a housing 11 made of a metal material such as aluminum having a rectangular opening 11 a. A cover 12 made of a resin material such as synthetic resin is attached to the opening 11 a so as to close the opening 11 a. Unitiz...

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PUM

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Abstract

A semiconductor device is provided that allows an IC chip and a heat sink to be prevented from being short-circuited even if facing surfaces of the IC chip and the heat sink are located closest to each other due to manufacturing variations and other variations. A controller for a motor apparatus includes a substrate on which MOSFETs are mounted and a heat sink provided facing the substrate and the MOSFETs so as to dissipate heat generated by the MOSFETs. Insulating portions are each provided on a facing surface of each MOSFETs. Protruding portions are each provided on a facing surface of the heat sink so as to protrude from the heat sink toward the insulating portion of the corresponding MOSFET. A second clearance smaller than the first clearance is formed between each of the insulating portions and the corresponding protruding portion.

Description

technical field [0001] The present invention relates to a semiconductor device and a motor device integrally provided with the semiconductor device. Background technique [0002] As a semiconductor device used in a controller of a motor device, etc., there is known a semiconductor device having a substrate on which an IC chip is mounted and a heat dissipation device provided on the surface of the substrate opposite to the surface near the IC chip. piece. In such a semiconductor device, the heat of the IC chip is transferred to the heat sink via the substrate, and then the heat is released from the heat sink to the outside air. [0003] However, in semiconductor devices, it is strongly desired to improve the heat dissipation performance of the IC chip without causing an increase in size. In order to meet such a strong desire, a heat dissipation device for releasing the heat of the IC chip is also provided on the surface of the substrate on the IC chip side. sheet (refer to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/31
CPCH01L23/3171H01L23/3185H01L23/3672B62D5/0406H01L23/3677H01L23/4006H05K7/20454H05K7/209H01L2023/4025H01L2023/4062H01L2023/4087H02K2211/03H01L2224/40137H01L25/072H02K11/33H05K1/0203H05K1/18
Inventor 佐藤裕人
Owner JTEKT CORP
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