Manufacturing method of radar transmit-receive component

Abstract

The invention discloses a manufacturing method of a radar transmit-receive component. The manufacturing method comprises the following process steps that aluminum alloy material of which the thermal resistance value is less than 0.1 is selected to be precisely casted into a substrate having three cavities; three low temperature co-firing ceramic plates are selected; the electronic elements of a transmitting component are divided into active elements and passive elements, the passive elements are embedded in a transmitting component layer, and the active elements are adhered in the transmitting component layer by using epoxy conductive adhesive; the transmitting component layer, a grounding layer and a receiving component layer are inserted in the three cavities; and the substrate of which the transmitting component layer, the grounding layer and the receiving component layer are installed is packed in the box. According to the manufacturing method of the radar transmit-receive component, the 3D packaging technology is introduced, the mode of vertical layered installation is adopted to realize high integration of the radar transmit-receive component, and the interference of the clutters on the radar transmit-receive signals can be weakened from the perspective of assembling so that the radar transmitting and receiving instruction can be enhanced.

Description

technical field [0001] The invention relates to the field of electromagnetic wave transmission, in particular to a method for manufacturing a radar transceiver component. Background technique [0002] The radar transceiver component includes a transmitting component and a receiving component. The transmitting component includes an amplifier, a voltage-controlled oscillator, a frequency multiplier, and a harmonic mixer. The receiving component consists of a two-stage low-noise amplifier MMIC chip and a one-stage electronically controlled attenuator MMIC chip. and resistance-capacitance components. At present, the transceiver components of common radars are usually separated from each other, divided into antenna, transmitter extension, receiver extension, control and display terminals, which are connected by wires, which is not conducive to portability or concealment. In recent years, the integration technology of electronic components has been popularized and applied. The ...

AI Technical Summary

Problems solved by technology

At present, the transceiver components of common radars are usually separated from each other, divided into antenna, transmitting extension, receiving extension, control and display terminals, which are connected to each other by wires, which is not conducive to portability or concealment

In recent years, the integration technology of electronic components has been popularized and applied. The transmitting component and the receiving component are integrated through a PCB board. The clutter leaked by the transmitting component greatly interferes with the useful signal received by the receiving component. And the transmitting component installed on a PCB board, The receiving component requires that the plane area of ​​the PCB must be large enough, and the integration effect is poor