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Preparation method of high-efficiency solidified water-resistant adhesive

A technology of adhesives and curing agents, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of limiting the application of epoxy resin, poor impact resistance, insufficient toughness, etc., and achieve mechanical properties Excellent, good durability, simple and easy preparation method

Inactive Publication Date: 2017-10-17
CHENGDU JIELEI SHADING ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has an obvious disadvantage, that is, insufficient toughness after curing, poor impact resistance, and easy cracking, which greatly limits the application of epoxy resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of high-efficiency curing water-resistant adhesive of the present embodiment, expressed in parts by weight, includes 150-270 parts of hydrogenated bisphenol A type epoxy resin base material, 20-45 parts of cyanoethylated diethylenetriamine curing agent, ethyl 6-12 parts of glycol diglycidyl ether, 15-30 parts of filler, 9-15 parts of acrylate rubber, 7-20 parts of dimethyl methyl phosphate.

[0030] Preparation method of the present invention, concrete steps are:

[0031] (1) First prepare the raw materials for the preparation of hydrogenated bisphenol A epoxy resin, expressed in parts by weight, take 6-8 parts of sodium hydroxide, 16-22 parts of epichlorohydrin, and 9-13 parts of hydrogenated bisphenol A, Methyl isobutyl ketone is added to the reaction kettle in a certain proportion, and a catalyst is added, then a constant temperature water bath of 50-60°C is stirred; then condensed and refluxed for 24 hours;

[0032] (2) After the reaction is completed, add d...

Embodiment 2

[0037] A kind of efficient curing water-resistant adhesive of the present embodiment is expressed in parts by weight, 160 parts of the hydrogenated bisphenol A type epoxy resin base material, 25 parts of cyanoethylated diethylenetriamine curing agent, ethylene glycol diethylene glycol 7 parts of glycidyl ether, 16 parts of filler, 10 parts of acrylate rubber, 10 parts of dimethyl methyl phosphate.

Embodiment 3

[0039] A kind of efficient curing water-resistant adhesive of the present embodiment, expressed in parts by weight, 220 parts of the hydrogenated bisphenol A type epoxy resin base material, 32 parts of cyanoethylated diethylenetriamine curing agent, ethylene glycol di 9 parts of glycidyl ether, 25 parts of filler, 12 parts of acrylate rubber, 15 parts of dimethyl methyl phosphate.

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PUM

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Abstract

The invention discloses a preparation method of a high-efficiency solidified water-resistant adhesive. The method comprises the following steps: 1) preparing a raw material of hydrogenated bisphenol type A epoxy resin, then preparing the hydrogenated bisphenol type A epoxy resin for standby; 2) performing modification on the hydrogenated bisphenol type A epoxy resin, adding a modifier and performing a heating reaction with the hydrogenated bisphenol type A epoxy resin to obtain the modified epoxy resin; 3) preparing a mixed curing agent, wherein the mixed curing agent comprises 20-45 pars of a cyanoethylated diethylenediamine curing agent, 6-12 parts of ethylene glycol diglycidylether, 15-30 parts of a filling material, 9-15 parts of an acrylic acid ester rubber, and 7-20 parts of dimethyl methylphosphate.; and 4) independently packaging the modified epoxy resin and the mixed curing agent, and packaging the every two materials. Through reasonable control the ratio between the reactants, the reaction condition can be controlled in a reasonable mode, and the epoxy resin adhesive with high endurance is prepared.

Description

technical field [0001] The invention relates to the field of polymer gels, in particular to a preparation method of an efficient curing water-resistant adhesive. Background technique [0002] As a commonly used adhesive product in the construction industry, construction adhesives are widely used in building construction and house interior decoration. For house interior decoration, floor adhesives are often used in composite floors. And floor glue commonly used at present usually contains organic poisons such as aldehydes, and its release can affect human health. Therefore, how to solve the problem of releasing polluting gas from the glue used in composite flooring is a technical problem that needs to be solved urgently. [0003] And epoxy resin adhesive can solve the problem of existing building adhesive as a kind of environment-friendly gel material, and described epoxy resin adhesive is a class by epoxy resin base material, curing agent, diluent, accelerator and Engineer...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C08G59/14C08G59/56
CPCC09J163/00C08G59/14C08G59/56C08L2201/08C09J11/04C09J11/06C09J11/08C08L33/04C08K3/36C08K5/521
Inventor 何金蓉
Owner CHENGDU JIELEI SHADING ENG CO LTD
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