Composite silver plating solution, preparing method for composite sliver plating solution, electro-deposition process for composite sliver plating solution and application of composite sliver plating solution

A technology of electrodeposition and mixed solution, which is applied in the direction of electrolytic coating, coating, etc., can solve the problems such as the performance degradation of double-check coating, and achieve the effect of improving performance, good controllability and excellent performance

Inactive Publication Date: 2017-09-29
ELECTRIC POWER RES INST OF GUANGDONG POWER GRID
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the composite silver plating solution disclosed by the present invention and its preparation method, electrodeposition process and application can effectively solve the problem that the graphite in the silver-graphite composite coating prepared by the current composite silver plating solution is not well bonded to the composite coating, causing re-examination Technical defect of coating performance degradation

Method used

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  • Composite silver plating solution, preparing method for composite sliver plating solution, electro-deposition process for composite sliver plating solution and application of composite sliver plating solution
  • Composite silver plating solution, preparing method for composite sliver plating solution, electro-deposition process for composite sliver plating solution and application of composite sliver plating solution
  • Composite silver plating solution, preparing method for composite sliver plating solution, electro-deposition process for composite sliver plating solution and application of composite sliver plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Test group 1 to test 6: 40g / L silver nitrate, 200g / L sodium thiosulfate, 40g / L potassium metabisulfite, 1g / L graphene oxide, 0.5g / LCTAB, polyethyleneimine 0.8g / L, 0.8g / L of thiosemicarbazide, stirred thoroughly and then ultrasonicated for 1h to prepare a composite silver plating solution.

[0042] After degreasing, grinding, ultrasonic cleaning, alkali cleaning and pickling, the copper substrate and silver sheet were placed in the composite silver plating solution of the above-mentioned test group 1 to test group 6, and then composite electrodeposition was performed to prepare a silver-graphene composite plating.

[0043] The parameters of composite electrodeposition are set as:

[0044] Test group 1: stirring speed: 400r / min; current density: 0.5A / dm 2 ; Plating temperature: 25°C; Electrodeposition time 30min; pH value of plating solution 5;

[0045] Test group 2: stirring speed: 600r / min; current density: 0.5A / dm 2 ; Plating temperature: 25°C; Electrodeposition ti...

Embodiment 2

[0052] Test group 1 to test 7: 40g / L silver nitrate, 200g / L sodium thiosulfate, 40g / L potassium metabisulfite, 1g / L graphene oxide, 0.5g / LCTAB, polyethyleneimine 0.8g / L, 0.8g / L of thiosemicarbazide, stirred thoroughly and then ultrasonicated for 1h to prepare a composite silver plating solution.

[0053] After degreasing, grinding, ultrasonic cleaning, alkali cleaning and pickling, the copper substrate and silver sheet were placed in the composite silver plating solution of the above-mentioned test group 1 to test group 7, and then composite electrodeposition was carried out to prepare a silver-graphene composite plating.

[0054] The parameters of composite electrodeposition are set as:

[0055] Test group 1: current density: 0.1A / dm 2 ; Stirring speed: 1000r / min; Plating temperature: 25°C; Electrodeposition time: 30min; pH value of plating solution: 5;

[0056] Test group 2: current density: 0.2A / dm 2 ; Stirring speed: 1000r / min; Plating temperature: 25°C; Electrodepositio...

Embodiment 3

[0064] Test group 1 to test 6: 40g / L silver nitrate, 200g / L sodium thiosulfate, 40g / L potassium metabisulfite, 1g / L graphene oxide, 0.5g / LCTAB, polyethyleneimine 0.8g / L, 0.8g / L of thiosemicarbazide, stirred thoroughly and then ultrasonicated for 1h to prepare a composite silver plating solution.

[0065] After degreasing, grinding, ultrasonic cleaning, alkali cleaning and pickling, the copper substrate and silver sheet were placed in the composite silver plating solution of the above-mentioned test group 1 to test group 6, and then composite electrodeposition was performed to prepare a silver-graphene composite plating.

[0066] The parameters of composite electrodeposition are set as:

[0067] Test group 1: Plating temperature: 20°C; current density: 0.5A / dm 2 ; Stirring speed: 1000r / min; Electrodeposition time 30min; pH value of plating solution 5;

[0068] Test group 2: Plating temperature: 25°C; current density: 0.5A / dm 2 ; Stirring speed: 1000r / min; Electrodeposition ...

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Abstract

The invention belongs to the field of electroplating, and in particular relates to a composite silver plating solution, a preparation method thereof and an electrodeposition process. The invention provides a composite silver plating solution, comprising the following components: 20-60g / L of a water-soluble silver-containing compound, 150-300g / L of sodium thiosulfate, and 20-60g / L of potassium pyrosulfite , 0.2-1g / L for polyethyleneimine, 0.2-1g / L for thiosemicarbazide, 0.1-2g / L for graphene oxide, and 0.05-1g / L for CTAB. The invention also discloses an electrodeposition process. The composite silver plating solution disclosed by the present invention and its preparation method and electrodeposition process can effectively solve the problem that the graphene in the silver-graphene composite coating prepared by the current composite silver plating solution is not well combined into the composite coating and the performance of the coating is not good. technical flaws.

Description

technical field [0001] The invention belongs to the field of electroplating, and in particular relates to a composite silver plating solution, a preparation method thereof, an electrodeposition process and application. Background technique [0002] The high-voltage isolating switch is one of the most widely used power transmission and transformation equipment in the power system, and it is also an important control and protection device. Whether its operating status is normal is related to the safety and stability of the entire power grid. Operation failure, broken insulator, overheating of conductive circuit and corrosion are the four main problems reflected in the current operation of disconnectors. [0003] At present, the material of the dynamic and static contacts of the isolating switch in China is mostly made of copper. In order to ensure good conductivity, the surface is generally silver-plated, that is, the pure silver plate is used as the anode, and the copper cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D3/46
CPCC25D15/00C25D3/46
Inventor 吕旺燕范圣平
Owner ELECTRIC POWER RES INST OF GUANGDONG POWER GRID
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