Signal Isolation Structures for Electromagnetic Communications

A communication module, signal leakage technology, applied in the direction of crosstalk/noise/electromagnetic interference reduction (, circuit, printed circuit, etc., can solve the problems of signal quality or integrity degradation, PCB discontinuity, mechanical impact effects, etc.) The effect of protecting reserved spectrum, low cost, and effective shielding

Active Publication Date: 2020-03-10
MOLEX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional connector and backplane structures often introduce various impedance discontinuities into the signal path, hinder transmission, and cause degradation of signal quality or integrity
Connecting to the PCB by conventional means—such as signal-carrying mechanical connectors—usually creates discontinuities that require expensive electronics to resolve
Conventional mechanical connectors can also wear out over time, require precise alignment and manufacturing methods, and are susceptible to mechanical shock

Method used

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  • Signal Isolation Structures for Electromagnetic Communications
  • Signal Isolation Structures for Electromagnetic Communications
  • Signal Isolation Structures for Electromagnetic Communications

Examples

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Embodiment Construction

[0031] This specification describes electromagnetic (EM) isolation structures for non-contact communication. Specifically, this specification describes the use of signal isolation structures to guide signals and reduce crosstalk between communication channels. This specification describes metal and absorber structures that can be used to isolate signals that might otherwise interfere with each other (e.g., between communication channels). The signal isolation structure is used to reduce the crosstalk between communication channels, while minimizing the physical separation between channels.

[0032] Contactless communication can be used to provide signal communication between components on a device, or it can provide communication between devices. In one example, a tightly coupled transmitter / receiver pair may be deployed with a transmitter arranged at the terminal portion of the first conductive path and a receiver arranged at the terminal portion of the second conductive path. ...

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Abstract

A signal isolation structure for electromagnetic communication is disclosed. Methods, systems, and apparatus for EM isolation structures. One of the devices includes a communication module comprising: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metal barrier structures configured to at least partially surround a corresponding integrated circuit package of the plurality of integrated circuit packages, wherein each metal barrier structure is configured to reduce signal leakage from the corresponding integrated circuit package.

Description

Technical field [0001] This manual deals with electromagnetic communication. Background technique [0002] Advances in semiconductor manufacturing and circuit design technology have enabled the development and production of integrated circuits (ICs) with increasingly higher operating frequencies. Furthermore, electronic products and systems containing high-frequency integrated circuits can provide more powerful functions than previous generation products. Additional functions usually include processing larger and larger amounts of data at higher and higher speeds. [0003] Many conventional electronic systems include multiple printed circuit boards (PCBs) on which ICs are mounted, and various signals are routed to and from ICs through them. The need to transmit information between PCBs in an electrical system with at least two PCBs has led to the development of various connectors and backplane architectures to facilitate the flow of information between PCBs. However, conventiona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/60H01L23/66
CPCH01L23/60H01L23/66H01L2223/6677H01L2924/181H05K1/0216H05K9/006H01L2224/48091H05K2201/10371H04B15/00H01L2224/48227H01L2924/00014H01L2924/00012H01L2224/45099H01L23/64H05K1/181H01L24/00
Inventor 穆斯塔法·纳吉布·阿卜杜拉穆罕默德·萨姆赫·马哈茂德艾伦·贝泽尔埃里克·斯威特曼博贾纳·日瓦诺伊克吉里拉杰·曼特拉瓦迪
Owner MOLEX INC
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