Copper foil substrate preparation method and metamaterial processing method using same

Abstract

The invention relates to the field of material processing and particularly relates to a copper foil substrate preparation method and a metamaterial processing method using the same. The method comprises steps of uniformly reducing the copper thickness by vacuum etching of a plurality of copper foil substrates of the ordinary thickness; determining the thicknesses of the plurality of copper foil substrates after reducing the copper thickness; and selecting a copper foil substrate having a copper thickness conforming to a copper thickness specification and a copper thickness uniformity to a preset threshold as a substrate for subsequent microstructure processing. The copper foil substrate preparation method applies the vacuum etching only used in the PCB production process to the uniform reduction of the copper thickness, through the vacuum etching, the copper foil substrate of the ordinary thickness is processed into the thin copper foil substrate used in the microstructure processing, the processed thin copper foil substrate has the same properties as the thin copper foil substrate supplied on the market, and the cost of the thin copper foil substrate obtained by the copper reduction process is reduced by more than half compared with the thin copper foil substrate of 3-9 um which is directly purchased from the market, so that the problems the existing thin copper foil substrate is high in cost, difficult to process and the like are solved.

Description

technical field [0001] The invention relates to the field of material processing, in particular to a method for preparing a copper foil base material and a metamaterial processing method using the same. Background technique [0002] At this stage, thin copper foil substrates (3-9um) are used for processing precision microstructures. However, thin copper foil substrates are processed by flash plating, which is difficult to process, prone to damage and other problems during processing, and has a low yield rate. , there are problems such as high cost and difficult processing, which seriously restrict the production demand of precision microstructures; as a relatively mature etching technology, vacuum etching applied in PCB production process not only installs nozzles in the etching section, but also An air extraction unit is installed between the nozzles relatively close to the surface of the circuit board. These air extraction units suck up the used etching liquid and return i...

AI Technical Summary

Problems solved by technology

[0002] At this stage, thin copper foil substrates (3-9um) are used for processing precision microstructures. However, thin copper foil substrates are processed by flash plating, which is difficult to process, prone to damage and other problems during processing, and has a low yield rate. , there are problems such as high cost and difficult processing, which seriously restrict the production demand of precision microstructures; as a relatively mature etching technology, vacuum etching applied in PCB production process not only installs nozzles in the etching section, but also An air extraction unit is installed between the nozzles relatively close to the surface of the circuit board. These air extraction units suck up the used etching liquid and return it to the liquid tank of the module through a closed circuit. The upward part of the board, The etching effect of the downward part and the edge of the board is basically the same, which overcomes the pool effect of etching and the difference in etching rate between the upper and lower sides to a certain extent.

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