Mesh electrode tandem type electrohydrodynamic micro-pump and method

Abstract

The invention discloses a mesh electrode tandem type electrohydrodynamic micro-pump and a method. The mesh electrode tandem type electrohydrodynamic micro-pump comprises a left electrode supporting guide rod and a right electrode supporting guide rod, and is characterized in that a plurality of mesh emitting electrodes are distributed at intervals in an array mode along the axial direction of the left electrode supporting guide rod; a plurality of mesh collecting electrodes are distributed at intervals in an array mode along the right electrode supporting guide rod; the mesh emitting electrodes and the mesh collecting electrodes are arranged in a mutually staggered manner so as to form a comb-shaped electrode array with the positive and negative electrodes being arranged in a staggered manner in the axial direction; the unoccupied ends, which extend out of the comb-shaped electrode array, of the left electrode supporting guide rod and the right electrode supporting guide rod are respectively connected with a positive electrode and a negative electrode of a power supply; and the space enclosed by the comb-shaped electrode array forms a working region of the mesh emitting electrodes and the mesh collecting electrodes and a circulating channel of a working medium. The comb-shaped electrode array is large in area, the range of an electrohydrodynamic action is increased, and an ion dragging effect is enhanced. Meanwhile, the needle-shaped structure enhances point discharge, and the power effect of the electrohydrodynamic micro-pump is improved.

Description

Technical field [0001] The invention relates to the field of microelectronic heat dissipation and trace fluid control, in particular to a mesh electrode series electrofluidic power micropump and a method. Background technique [0002] With the further development of the miniaturization and high performance of electronic components, the heat flux density of the next generation of electronic components will continue to increase. However, the reliability of microelectronic devices is very sensitive to temperature, and the increase in device temperature will cause its reliability to decrease. Some gas cooling technologies can no longer meet the heat dissipation requirements of such a high heat flux density, so there is an urgent need to develop a new generation of liquid cooling technology. [0003] Faced with the narrow heat dissipation space of future electronic products and high heat flux density of heating elements, the heat dissipation problem in the field of microelectronics has ...

AI Technical Summary

Problems solved by technology

It aims to improve the efficiency of the existing electrohydrodynamic micropump, and solve the problem of low pump pressure and poor driving effect

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