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Sepiolite urea-formaldehyde resin adhesive and preparation method thereof

A technology of sepiolite urea-formaldehyde resin and urea-formaldehyde resin, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., which can solve the problem of excessive free formaldehyde content, poor aging resistance, and limited use range and other problems, to achieve the effect of special pore structure, enhanced curing tensile force, and excellent adsorption performance

Inactive Publication Date: 2017-08-25
湖南栿兴木业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Urea-formaldehyde glue has many advantages such as high bonding strength, fast curing, colorless cured glue layer, simple production, abundant raw material sources, cheap and easy to obtain, and good operability. Therefore, it has become the main glue for decorative panels in my country. There are disadvantages such as poor water resistance, high brittleness of the adhesive layer after curing, poor aging resistance, excessive free formaldehyde content, and harmfulness to the human body during the production process, which have long restricted the quality of the company's products and limited its scope of use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] (1) In parts by weight, add 100 parts of water to the reaction kettle, add 5.5 parts of cornstarch and 10 parts of sepiolite powder while stirring; At ~90°C, keep warm for 15 minutes, and the emulsion is milky white; (3) After adding formaldehyde, add a modified sepiolite additive accounting for 10% of the total weight of the finished sepiolite urea-formaldehyde resin glue, and adjust the pH value to 8.5-9.0 with lye , heat up to 40°C, put in the first batch of urea, the molar ratio of urea to formaldehyde is 1:2.059; (4) When the temperature rises to 85°C, adjust the pH value to 6.5 with acid solution, and wait until the temperature reaches 90-92°C (5) add formic acid solution, adjust the ph value to 5.0-4.8, the reaction temperature is 90-94°C, and the time is 60-70 minutes; (6) After the viscosity reaches about 18.5 seconds / 25°C, observe At the end of the reaction, use lye to adjust the pH value to 6.5-6.7, put in the second urea, the reaction molar ratio of urea to ...

Embodiment 2

[0013] (1) In parts by weight, add 100 parts of water to the reaction kettle, add 6.5 parts of cornstarch and 25 parts of sepiolite powder while stirring; At ~90°C, keep warm for 15 minutes, the emulsion is blue-gray and translucent; (3) After adding formaldehyde, add modified sepiolite additive accounting for 10% of the total weight of the finished sepiolite urea-formaldehyde resin glue, and adjust the pH with lye The value is 8.5~9.0, the temperature rises to 40°C, and the first batch of urea is put in. The reaction molar ratio of urea to formaldehyde is 1:2.059; (4) When the temperature rises to 85°C, adjust the pH value to 6.5 with acid solution, and wait until the temperature reaches At 90-92°C, keep warm for 20 minutes; (5) Add formic acid solution, adjust the pH value to 5.0-4.8, and the reaction temperature is 90-94°C, and the time is 60-70 minutes; (6) When the viscosity reaches about 18.5 seconds / 25 After ℃, observe the end point of the reaction, adjust the pH value ...

Embodiment 3

[0015] (1) In parts by weight, add 100 parts of water to the reaction kettle, add 7.5 parts of cornstarch and 40 parts of sepiolite powder while stirring; At ~90°C, keep warm for 15 minutes, the emulsion is blue-gray with sediment; (3) After adding formaldehyde, add modified sepiolite additive accounting for 10% of the total weight of the finished sepiolite urea-formaldehyde resin glue, adjust the pH with lye The value is 8.5~9.0, the temperature rises to 40°C, and the first batch of urea is put in. The reaction molar ratio of urea to formaldehyde is 1:2.059; (4) When the temperature rises to 85°C, adjust the pH value to 6.5 with acid solution, and wait until the temperature reaches At 90-92°C, keep warm for 20 minutes; (5) Add formic acid solution, adjust the pH value to 5.0-4.8, and the reaction temperature is 90-94°C, and the time is 60-70 minutes; (6) When the viscosity reaches about 18.5 seconds / 25 After ℃, observe the end point of the reaction, adjust the pH value to 6.5...

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Abstract

The invention discloses a sepiolite urea-formaldehyde resin which is prepared from urea-formaldehyde resin and a modified sepiolite additive, wherein the weight of the modified sepiolite additive added is 10%-35% of the total weight of the end product of sepiolite urea-formaldehyde resin. The preparation of the modified sepiolite additive comprises the following steps: (1) adding 100 parts of water into a reaction kettle and adding 5-7 parts of corn starch and 18-35 parts of sepiolite powder while stirring; (2) stirring and heating for 40-60 minutes, stopping heating at 85 DEG C and performing heat preservation for 15 minutes at 87-90 DEG C; (3) cooling to 45-50 DEG C, thereby acquiring the modified sepiolite additive. In the process of preparing the sepiolite urea-formaldehyde resin adhesive, the modified sepiolite additive is added in two modes: (1) adding the additive at the initial stage of feeding, namely, adding the additive after formaldehyde is completely added and (2) adding the additive at the middle stage of urea-formaldehyde resin adhesive reaction, namely, adding the additive before acid regulation. According to the invention, the modified sepiolite additive is added for restraining the decomposition of the urea-formaldehyde resin adhesive, reducing released free formaldehyde, obviously increasing the initial viscosity of the urea-formaldehyde resin adhesive, relieving the liquidity and increasing the gluing volume.

Description

technical field [0001] The invention relates to an adhesive, in particular to a sepiolite urea-formaldehyde resin glue and a preparation method thereof. Background technique [0002] Urea-formaldehyde glue has many advantages such as high bonding strength, fast curing, colorless cured glue layer, simple production, abundant raw material sources, cheap and easy to obtain, and good operability. Therefore, it has become the main glue for decorative panels in my country. There are disadvantages such as poor water resistance, high brittleness of the adhesive layer after curing, poor aging resistance, excessive free formaldehyde content, and harmfulness to the human body during the production process, which have long restricted the quality of the company's products and limited its scope of use. Contents of the invention [0003] Aiming at the shortcomings of urea-formaldehyde adhesives, such as poor water resistance and excessive free formaldehyde content, the present invention p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/24C09J11/04C08G12/12
Inventor 马剑马宪平
Owner 湖南栿兴木业有限公司
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