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Quantum dot interlayer CSP backlight with luminescence of five surfaces and manufacturing method thereof

A quantum dot and backlight technology, applied in the field of backlight, can solve problems such as quantum dot powder performance attenuation, achieve high yield, high light extraction efficiency, and improve light efficiency

Inactive Publication Date: 2017-08-18
ANHUI COREACH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because quantum dot powder is more sensitive to humidity and temperature, it may cause quantum dot powder performance attenuation.

Method used

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  • Quantum dot interlayer CSP backlight with luminescence of five surfaces and manufacturing method thereof
  • Quantum dot interlayer CSP backlight with luminescence of five surfaces and manufacturing method thereof
  • Quantum dot interlayer CSP backlight with luminescence of five surfaces and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0031] Such as image 3 As shown, the embodiment of the present invention provides a five-sided luminous quantum dot interlayer CSP backlight, including a luminous flip chip 1, which also includes an inner transparent glue layer 2 wrapped around the upper end and surroundings of the flip chip 1, so The inner transparent glue layer 2 is wrapped with a quantum dot glue layer, and the quantum dot glue layer 3 is wrapped with an outer transparent glue layer 4; the quantum dot glue layer 3 is formed by curing encapsulation glue dissolved with quantum dot fluorescent powder.

[0032] The CSP backlight provided by this embodiment emits light outward through the upper end and the surrounding area.

[0033] The inner transparent glue layer 2 is a high-refractive-index transparent glue layer; the high-refractive-index transparent glue has a refractive index of 1.50-1.55 and is made of epoxy resin or organic silica gel.

[0034] The outer transparent glue layer 4 has glue with a strong ...

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PUM

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Abstract

The present invention provides a five-sided light-emitting quantum dot interlayer CSP backlight, including a light-emitting flip chip, and an inner transparent glue layer wrapped around the upper end and the periphery of the flip chip, and the inner transparent glue layer is wrapped with quantum dots A glue layer, the quantum dot glue layer is wrapped with an outer transparent glue layer; the quantum dot glue layer is formed by curing the encapsulation glue dissolved with the quantum dot phosphor powder. The quantum dot glue layer of the CSP backlight provided by the invention has a low working temperature, which reduces the temperature decay of the quantum dot powder; when driven by the same current, the CSP adopts a high-power flip chip to generate lower heat than traditional lamp beads.

Description

technical field [0001] The invention relates to the field of backlight technology, in particular to a quantum dot interlayer CSP backlight source emitting light from five sides. Background technique [0002] CSP (Chip Scale Package) is called a chip-scale package. The most typical CSP is a five-sided light-emitting CSP, which is wrapped with fluorescent glue around the flip chip 1 and the top 2, and the four sides and the top are light-emitting, such as figure 1 shown. [0003] Compared with traditional packaged lamp beads, the number of brackets and substrates is reduced, effectively reducing costs. CSP has small size, light weight, good electrical and thermal performance, and improves the reliability of backlight. CSP adopts flip-chip, which avoids the abnormal wiring of traditional LEDs and the problem of easy-to-dead lamps. The five-sided CSP emits light on the top and around the chip, and the light output angle is large. [0004] Quantum Dot (Quantum Dot), also know...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/504H01L33/507H01L2933/0041
Inventor 崔杰孙海桂陈龙
Owner ANHUI COREACH TECH
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