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A precise positioning cutting device for sapphire processing

A technology of precise positioning and cutting devices, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of difficult adjustment of steel wire tension, inability to position and cut sapphire, and affect the quality of sapphire, so as to improve cutting Quality, good cutting quality, good clamping effect

Active Publication Date: 2019-02-15
TDG YINXIA NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing sapphire cutting device has loose and unreliable defects when clamping the gem, which makes it impossible to accurately position and cut the sapphire. At the same time, it is difficult to adjust the tension of the steel wire, the cutting quality is not good, and it is prone to chipping, etc. Defects that affect the quality of sapphire after cutting

Method used

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  • A precise positioning cutting device for sapphire processing
  • A precise positioning cutting device for sapphire processing
  • A precise positioning cutting device for sapphire processing

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0021] refer to Figure 1-4 , a precise positioning cutting device for sapphire processing, including a device base 1, two U-shaped support rods 2 are symmetrically arranged on the upper end surface of the device base 1, and one end of the U-shaped support rod 2 away from the device base 1 is provided with a motor for installing The mounting bracket 5 of the reel 3, the two electric reels 3 are wound with a cutting wire 6 for cutting sapphire, the cutting wire 6 is a steel wire with better flexibility, and the surface of the cutting wire 6 is passed through the adhesive Bonded with diamond cutting particles, the hardness of the sapphire is relatively high, and the di...

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Abstract

The invention relates to the technical field of gem processing, in particular to an accurate positioning and cutting device for sapphire processing. The device comprises a device base; two U-shaped supporting rods are symmetrically arranged on the upper end surface of the device base; a mounting support for mounting an electric winding reel is arranged at one end, far away from the device base, of each U-shaped supporting rod; cutting wires for cutting sapphire wind around the two electric winding reels; electric telescopic rods are symmetrically mounted on the upper end surface of the device base; one end, far away from the device base, of each electric telescopic rod is fixedly connected with a carrying platform; a supporting frame is arranged at one end, far away from the carrying platform, of a fixing plate; and a water spray pipe penetrates through the supporting frame and is used for spraying a cutting fluid to sapphire located between a first clamping plate and a second clamping plate. Compared with an existing cutting device, the accurate positioning and cutting device for sapphire processing can position the sapphire accurately and stably and has the advantages of high cutting quality and stable cutting speed.

Description

technical field [0001] The invention relates to the technical field of gemstone processing, in particular to a precise positioning cutting device for sapphire processing. Background technique [0002] The wire cutting mechanism of sapphire is that the machine guide wheel drives the steel wire during high-speed operation, and the steel wire continuously rubs against the sapphire pressed on the steel wire during high-speed operation to complete the cutting process. During the whole cutting process, the viscosity of the cutting fluid, the speed of the steel wire, the tension of the steel wire, the way of cutting the knife and the feed speed of the workpiece play a major role in the quality and yield of sapphire. The existing sapphire cutting device has loose and unreliable defects when clamping the gemstone, which makes it impossible to accurately position and cut the sapphire. At the same time, it is difficult to adjust the tension of the steel wire, the cutting quality is not...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/02
CPCB28D5/0058B28D5/0076B28D5/04B28D7/02
Inventor 孙亚雄常慧张吉段斌斌程佳宝朱宏杰唐彩莉
Owner TDG YINXIA NEW MATERIAL CO LTD
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