Manufacturing technology of radiating fin for smart phone

Abstract

The invention discloses a manufacturing technology of a radiating fin for a smart phone. The radiating fin is obtained through the following step of (1) coating the upper surface and lower surface of a polyimide film with a graphite modifier separately to obtain a treated polyimide film, wherein the treated polyimide film comprises a polyimide film, a first coating layer and a second coating layer; and the graphite modifier is prepared from the following components in parts by weight: 25 parts of diphenylketone tetrahydride, 16.5 parts of benzenetetracarboxylic anhydride, 23.5 parts of diaminodiphenylmethane, 22 parts of dimethylformamide, 9 parts of N-methyl pyrrolidone, 2 parts of ethylene glycol, 2.5 parts of polydimethylsiloxane and 1.5 parts of dibutyl phthalate. An azeotropic point and a smooth boiling point area are reduced, and the film-forming flatness and flexibility of a final product are improved.

Description

technical field [0001] The invention relates to a heat sink manufacturing process for smart phones, and belongs to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly tra...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness