Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of fabrication method of surface plasmon resonance instrument chip

A technology of surface plasmon and production method, which is applied in the field of ion resonance chip production, can solve the problems of sensor chip surface pollution, false positive, and reduce the accuracy of quantitative detection, and achieve easy self-assembly, improved efficiency, and simple preparation method fast effect

Active Publication Date: 2019-09-03
丁利 +5
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when surface plasmon resonance is used for analysis and testing, the surface contamination of the sensor chip is a common problem, and non-specific adsorption from biomolecules or microorganisms in the sample will reduce the accuracy of quantitative detection and produce false positive results

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of fabrication method of surface plasmon resonance instrument chip
  • A kind of fabrication method of surface plasmon resonance instrument chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method for making a surface plasmon resonance chip based on lysine modification and mucin modification, comprising the following steps:

[0029] a) A 2nm-thick chrome layer and a 48nm-thick gold film were coated on the BK7 glass substrate by electron beam evaporation coating technology, and a bare gold chip was obtained.

[0030] b) Bare gold chip pretreatment: immerse the obtained bare gold chip in a mixed solution of water, 30% concentrated ammonia water and 30% hydrogen peroxide (volume ratio 3:1:1), and soak at 70° C. for 20 minutes. Then take it out, wash it three times with deionized water, and dry it with nitrogen gas for later use.

[0031] c) Pretreatment of mucin solution: prepare 5 mg / mL mucin (secreted from pig stomach) solution with phosphate buffer solution with pH 7.4, and centrifuge the obtained solution at 11000 rpm for 10 minutes to remove aggregated protein.

[0032] d) Mucin modification The SPR chip dried with nitrogen gas was attached to the pri...

Embodiment 2

[0037] A method for making a surface plasmon resonance chip based on lysine modification and mucin modification, comprising the following steps:

[0038] a) A 3nm thick chromium layer and a 47nm thick gold film were coated on the BK7 glass substrate by electron beam evaporation coating technology, and a bare gold chip was obtained.

[0039] b) Bare gold chip pretreatment: immerse the obtained bare gold chip in a mixed solution of water, 30% concentrated ammonia water and 30% hydrogen peroxide (volume ratio 3:1:1), and soak at 80° C. for 10 min. Then take it out and wash it three times with deionized water, and dry it with nitrogen gas for later use.

[0040] c) Pretreatment of mucin solution: 3 mg / mL mucin (secreted from the stomach of pigs) solution was prepared with phosphate buffer solution with a pH of 7.4, and the resulting solution was centrifuged at 9000 rpm for ten minutes to remove aggregated proteins.

[0041] d) Mucin modification: attach the cleaned SPR chip to the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing a surface plasmon resonator chip based on lysine modification and mucoprotein modification. The chip comprises a BK7 glass sheet substrate, the BK7 glass sheet substrate is plated with a chromium layer of 2 nm to 3 nm and a gold film layer of 47 nm to 48 nm, amphipathic mucoprotein is connected to the surface of the gold film through hydrophobic groups of a protein framework, carboxyl groups of sugar residues on mucoprotein side chains are activated through 1-(3-dimethylamino propyl)-3-EDAC and N-hydroxysuccinimide and used for being coupled with lysine, and therefore the mucoprotein surface plasmon resonator chip based on lysine modification is obtained. The chip manufactured through the method has the high antifouling property in a single protein system and a complex system with the pH equal to 7.4 and can be easily assembled on various surfaces, and a stable and regular monomolecular layer is formed. The chip has the excellent antifouling property and high stability, the preparation method is relatively easy and convenient, and high feasibility and universality are achieved.

Description

technical field [0001] The invention relates to the field of preparation of an anti-pollution chip of a surface plasmon resonance spectrometer, in particular to a method for manufacturing a chip of a surface plasmon resonance spectrometer. Background technique [0002] The Surface Plasmon Resonance (SPR) instrument is a biosensor technology that appeared in the 1980s. When the incident light is incident from a high-refractive-index medium to a low-refractive-index medium, total reflection will occur. A layer of metal film (gold or silver) is coated at the interface of the medium. The evanescent wave generated by the incident light will cause the free electrons on the metal surface to oscillate collectively, and then form plasma. When the frequency and wave number of the evanescent wave and surface plasmon oscillation When they are equal, the resonance phenomenon (SPR) will occur, which will cause the energy to transfer from the evanescent wave to the surface plasmon wave, so...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/552
Inventor 丁利苏荣欣叶慧君王利兵齐崴王季诚
Owner 丁利
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com