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Cuprous-ion complex having thermal-activation delayed fluorescence and preparation and application thereof

A thermal activation delay, cuprous ion technology, applied in the direction of copper organic compounds, 1/11 group organic compounds without C-metal bonds, chemical instruments and methods, etc., can solve poor stability, difficult purification, instability In order to achieve the effect of simple preparation process, abundant sources of ligands and high efficiency

Active Publication Date: 2017-08-11
SHANGHAI UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention proposes a cuprous ion complex with thermally activated delayed fluorescence and its preparation and application, which solves the difficulties in the preparation and purification of copper metal complexes in the prior art and the instability in the process, and at the same time, it can be used in evaporation Technical problems with poor stability in the process

Method used

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  • Cuprous-ion complex having thermal-activation delayed fluorescence and preparation and application thereof
  • Cuprous-ion complex having thermal-activation delayed fluorescence and preparation and application thereof
  • Cuprous-ion complex having thermal-activation delayed fluorescence and preparation and application thereof

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Embodiment 1

[0040] After the glass substrate 101 with the ITO transparent electrode carries out ultrasonic cleaning for 5 minutes in acetone and isopropanol, a hole injection layer (HIL) 103 of 5-20 nanometers is vacuum-deposited on ITO102, and then vapor-deposited 5- A hole transport layer (HTL) 104 of 40 nanometers, and then an electron blocking layer (EBL) 105 of 5-20 nanometers is vapor-deposited, and then the above-mentioned organic ligand L is co-evaporated with a copper source to form CuX: the weight percentage of L is 1 -12%, a thickness of 5-40 nanometers of light-emitting layer (EML) 106, on this light-emitting layer, successively vapor-deposit hole blocking layer (HBL) 107 thick 5-20 nanometers, electron transport layer (ETL) 108 thick 5 -60 nanometers, the electron injection layer (EIL) is 0.5-30 nanometers, and the electrode 109 is 20-100 nanometers thick, forming an organic electroluminescent diode element.

[0041] Embodiment device structure is as follows:

[0042]

[...

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Abstract

This invention provides a cuprous-ion complex having thermal-activation delayed fluorescence and preparation and application thereof. A structural general formula of the complex is (CuX)mLn, wherein X is Cl, Br, I or CN, L represents a nitrogenous organic compound, m represents 1-4, and n represents 1-4. The preparation method includes the steps that a cuprous source CuX and an organic ligand L are subjected to vacuum co-evaporation, solution spinning, solution printing or blending milling to obtain the cuprous-ion complex described in claim 1 or 2. The cuprous-ion complex is applied to electroluminescent elements. The cuprous-ion complex having thermal-activation delayed fluorescence has the advantages of rich ligand sources and high efficiency. The preparation process is simple, and the cuprous-ion complex is suitable for industrialized popularization and application.

Description

technical field [0001] The invention relates to the field of organic electroluminescent materials, in particular to a cuprous ion complex with heat-activated delayed fluorescence and its preparation and application. Background technique [0002] Since Deng Qingyun and others first reported organic thin-film electroluminescent devices (OLEDs, organic light-emitting diodes) in 1987, because of their advantages such as low-voltage drive, high efficiency, active light emission, fast response, rich colors and flexibility, It has become one of the mainstream technologies for next-generation flat panel display. Although green and red phosphorescent materials based on rare metal iridium complexes have met industrial applications and are widely used in commercial OLED display devices, the content of metal iridium in the earth's crust is very limited. It is estimated that if such OLEDs are applied to all display and lighting equipment in the world in the future, the iridium metal in ...

Claims

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Application Information

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IPC IPC(8): C07F1/08C09K11/06H01L51/54
CPCC09K11/06C07F1/005C09K2211/188H10K85/371
Inventor 王子兴陈安平祝俊
Owner SHANGHAI UNIV
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