Heat-dissipating computer case shell being easy to detach
A technology of mainframe shell and heat dissipation shell, which is applied in computing, instrumentation, electrical digital data processing, etc., can solve the problems that the heat dissipation of the mainframe shell of the computer is not convenient enough, and achieve the effect of convenient life, saving time and reducing operation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0016] see Figure 1-3 , the present invention provides a technical solution: an easy-to-disassemble computer heat dissipation mainframe shell, including a heat dissipation shell 2, an overturning main body 5 and a mainframe shell main body 6, and the heat dissipation shell 2 is fixedly connected to one side of the mainframe shell main body 6 to help heat dissipation work, The heat dissipation shell 2 includes a first water storage tank 7, a connecting pipe 8,...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com