A kind of preparation method of bonding alloy wire

Abstract

The invention discloses a method for preparing a bonded alloy wire, which comprises the following steps: (1) purchasing 99.995% silver and making it into a silver sheet; (2) making an intermediate alloy; (3) vertical melting; (4) wire drawing ; (5) intermediate annealing; (6) re-drawing (7) annealing; (8) coiling; (9) vacuum packaging. Compared with the prior art, the present invention has the following advantages: in this preparation method: (1) an intermediate annealing process is added to eliminate stress when the wire drawing reaches 70-100 μm, so that the wire drawing is smoother and the wire is not easy to break; (2) after the finished wire is annealed The surface treatment effectively prevents the bonding effect of self-diffusion between the bonded alloy wires and improves the product yield; effectively reduces the surface residue of the alloy wires and improves product quality. In the preparation method, the lubricating liquid on the surface of the alloy wire is effectively cleaned by using an ultrasonic cleaning system, thereby effectively reducing the surface residue of the alloy wire and improving product quality.

Description

technical field [0001] The invention relates to an alloy material, in particular to a method for preparing a bonding alloy wire. Background technique [0002] Bonding gold wire is an alloy wire used as a connecting wire in an integrated circuit. Its gold content ≥ 99.99%, high reliability, but the price of gold is high; bonding copper wire is also a kind of bonding wire with high reliability, but the disadvantage is that it is extremely easy to oxidize. [0003] With the rapid development of the semiconductor industry, there is an urgent need for a material that is less expensive and less oxidizable to replace. Through the research on silver and other materials, it is decided to use silver to replace gold. Silver has the same inertness as gold, and there is no such thing as copper. The same easy-to-oxidize characteristics, and at the same time, adding some trace elements makes silver have the characteristics of bonding, making the balls more round and easy to bond. [0004...

AI Technical Summary

Problems solved by technology

[0004] Moreover, in the production process, it is easy to produce a self-diffusion bonding effect between the bonding alloy wires at this time, and then produce a large number of broken wires.

At the same time, in the preparation process of bonded alloy wire, the viscosity of the lubricating liquid used in the coarse and medium drawing processes of wire drawing is relatively high, and there will be more lubricating liquid remaining on the surface of the wire after wire drawing and the sliding between grains during the wire drawing process. If the stress is directly annealed without treatment, the residual lubricating fluid will affect the surface cleanliness of the finished product line, thereby affecting the quality of the final product