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Resin Fluxed Solder Paste, And Mount Structure

A technology of flux and resin, applied in the field of resin flux solder paste and mounting structure, can solve problems such as rising cost, and achieve the effects of improving drop resistance, improving meltability, and suppressing reduction effect

Active Publication Date: 2017-07-04
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the manufacture of electronic devices that require a slight reduction in manufacturing cost, this process becomes a major cause of cost increase.

Method used

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  • Resin Fluxed Solder Paste, And Mount Structure
  • Resin Fluxed Solder Paste, And Mount Structure
  • Resin Fluxed Solder Paste, And Mount Structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0066]

[0067] The resin flux solder paste according to Embodiment 1 includes non-resin-based powder including solder powder and inorganic powder, and flux including a first epoxy resin, a curing agent, and an organic acid. The non-resin powder is 30 to 90 wt% of the whole. On the other hand, 10 to 70 wt% of the remaining portion is composed of flux including the first epoxy resin, curing agent, and organic acid. The surface of the inorganic powder is covered with an organic resin. The inorganic powder can be, for example, silicon dioxide. The organic resin may be, for example, a second epoxy resin.

[0068] According to this resin flux solder paste, when used for solder bonding of electronic components to circuit boards, since it contains inorganic powder, it is possible to reinforce the reinforcing part more firmly with the resin of the solder joint part without using an underfill material. . Therefore, the drop resistance of the attachment structure can be improved. ...

Embodiment 2

[0151] Example 2 was the same as Example 1, and the ratio of the non-resin powder was 90 wt%. In addition, as fused silica, (a) silica having a particle diameter of 1 μm was used. The ratio of the solder powder to the silica was 5% of the silica with respect to the whole non-resin powder.

Embodiment 3

[0152] The ratio of the non-resin powder of Example 3 was 70 wt%. In addition, as fused silica, silica having a particle diameter of (c) of 11 μm was used. The ratio of the solder powder to the silica was compounded at 40% of the silica relative to the entire non-resin powder.

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Abstract

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Description

technical field [0001] The present invention mainly relates to a resin flux solder paste having a flux component containing an epoxy resin among solder pastes used for soldering semiconductor components, electronic components, etc. to a circuit board, and a mounting structure. Background technique [0002] In recent years, mobile devices such as mobile phones and PDAs (Personal Digital Assistants) have been miniaturized and enhanced in functionality. Mounting structures such as BGA (Ball Grid Array) and CSP (Chip Scale Package) are often used as mounting technologies that can cope with this development. Mobile devices are subject to mechanical loads such as drop shocks. For QFP (Quad Flat Package), the lead part absorbs the impact. However, for BGAs, CSPs, and the like that do not have lead wires for cushioning shocks, it is important to secure shock resistance reliability. [0003] The melting point of Pb eutectic solder, which is a conventional typical solder, is 183°C....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/264B23K35/36H05K2201/0227B23K35/24H05K3/3436H05K3/3463H05K2201/0209H01L2224/13311H01L2224/13499H01L2224/81905H01L2224/13313H01L23/49883H01L24/16H01L24/81H01L2224/13023H01L2224/13294H01L2224/133H01L2224/1601H01L2224/16013H01L2224/16058H01L2224/16227H01L2224/16505H01L2224/81193H01L2224/8121H01L2224/81815H01L2224/81862H01L2224/1329H01L2224/13387H01L2224/1349H01L24/13H01L2924/01029H01L2924/01047H01L2924/0105H05K3/3485H01L2224/1132H01L2924/00012H01L2924/00014H01L2924/014H01L2924/0665H01L2924/05442H01L2924/01083H01L2924/01049H01L2924/05432H01L2924/0549H01L2924/0532H01L2924/01012H01L2924/066H05K1/11H05K1/18H05K3/34H05K3/3457H05K3/3489
Inventor 日野裕久大桥直伦吉冈祐树森将人铃木康宽
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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