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A device and method for locally strengthening the elastic mold of a microfluidic chip

一种微流控芯片、弹性模具的技术，应用在家里用具、其他家里用具、纳米技术等方向，能够解决提高的幅度有限等问题，达到增强机械强度、机械强度加强的效果

Inactive Publication Date: 2020-08-25
GUANGDONG UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although these methods can improve the strength of PDMS to a certain extent, the improvement range is very limited, which is far from meeting the current needs.

Method used

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  • A device and method for locally strengthening the elastic mold of a microfluidic chip
  • A device and method for locally strengthening the elastic mold of a microfluidic chip

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] Please refer to Figure 1 ~ Figure 2 , figure 1 A structural schematic diagram of a specific embodiment of a microfluidic chip elastic mold local reinforcement molding device provided by the embodiment of the present invention; figure 2 It is a schematic flow chart of the steps of a specific implementation of the local reinforcement molding method for the elastic mold of the microfluidic chip provided by the embodiment of the present invention.

[00...

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Abstract

The invention discloses a microfluidic chip elastic mold local strengthening molding device and method, wherein the device includes a processing tank arranged on a machine tool, a mold master with a mold master clamp is installed in the processing tank, and a cathode of an electrophoretic auxiliary system It is connected to the spindle of the machine tool, and the output end of the electrophoresis auxiliary system is connected to the cathode and the mold master fixture to form an auxiliary electric field between the mold master and the cathode, so that the particle colloid circulation system mixes the strengthening particle colloid and the filler colloid to generate The mixed colloid is deposited in the area to be strengthened in the elastic mold, and the vacuum temperature control system is used to heat-treat and solidify the formed mixed colloid. Through the electrophoresis auxiliary system, an auxiliary electric field is formed between the mold master and the electrophoretic cathode to realize the directional deposition of nanoparticles mixed in the colloid. While enhancing the mechanical strength of the elastic mold, it is also possible to control the strengthening position of the nanoparticles in the mold to achieve The purpose of strengthening the mechanical strength of a specific area.

Description

technical field [0001] The invention relates to the technical field of elastic molds for microfluidic chips, in particular to a device and method for locally strengthening the elastic molds for microfluidic chips. Background technique [0002] In today's society, the application of materials involves all aspects of life and production. Different materials have their own characteristics and application ranges, and the requirements for the quantity and quality of various materials are getting higher and higher. As a material with excellent performance, non-metal is widely used in various fields of product processing. According to the good toughness, elasticity, plasticity and other properties of non-metallic materials, the industry is often used to make molds, but also because of these properties lead to some defects in its own mechanical properties, which also limit its application range in products. In order to improve the strength, hardness, rigidity, wear resistance, corr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C33/38B29C33/40
CPCB29C33/3842B29C33/40B29K2105/162B29L2031/756B29C33/3807B29C33/3878B29C33/424B29C33/50B82Y40/00
Inventor 何俊峰郭钟宁吴明张传运陈晓磊
Owner GUANGDONG UNIV OF TECH
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