3D connected fan-out type packaging structure and process method therefor

Abstract

The invention relates to a 3D connected fan-out type packaging structure and a process method therefor. The packaging structure comprises a circuit layer (1), wherein a chip (3) is arranged on the back surface of the circuit layer (1); a re-wiring circuit layer (2) is arranged on the front surface of the chip (3); the chip (3) and the re-wiring circuit layer (2) are connected through metal sphere cylinders (4) and first bonding wires (5); the peripheries of the circuit layer (1), the re-wiring circuit layer (2) and the chip (3) are all encapsulated with a first plastic sealing material (6) separately; an electronic element (9) or a packaging element (10) is arranged on the front surface of the circuit layer (1); and the periphery of the electronic element (9) or the packaging element (10) is encapsulated with a second plastic sealing material (11). According to the 3D connected fan-out type packaging structure and the process method therefor, a conventional two-end routing method is adopted to realize wire bonding on the chip and the metal circuit layer or the metal circuit layer of the adjacent packaging element, so that height and stability can be improved, and routing efficiency can be improved.

Description

technical field [0001] The invention relates to a 3D-connected fan-out packaging structure and a process method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] In the existing semiconductor stack packaging technology, solder balls were commonly used as the connection carrier of the stack. Fix the solder balls on the substrate by planting balls. After the solder balls are molded and coated, the solder balls are partially exposed through the process of laser drilling, and then the next packaging process is continued on the solder balls. The ball diameter and spacing of the balls limit the number and arrangement density of the longitudinal engagement elements. In order to overcome the shortage of solder balls, a method of interconnecting through metal pillars has been developed. The metal pillars are arranged around the substrate and surround the chips on the substrate to serve as input / output connection pads interconnected w...

AI Technical Summary

Problems solved by technology

However, with the further reduction in the size of packaged products and the limitation of the manufacturing process of metal pillars, it is difficult to further increase the number of metal pillars on the substrate, so the number of interconnected I / Os cannot be increased.

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