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Mixed laminating board with three-layer HDI (high density interconnect) board and aluminum substrate and manufacturing method thereof

A production method and technology for aluminum substrates, which are applied in the directions of multi-layer circuit manufacturing, printed circuit manufacturing, and conductive pattern layout details, etc., can solve the problems of difficult production of mixed-press boards, product quality and precision need to be improved, etc., so as to reduce the production difficulty, Improve the precision of the finished product and avoid the effect of warping

Active Publication Date: 2017-06-13
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a mixed laminated board of three-layer HDI board and aluminum substrate and its manufacturing method, aiming to solve the problems that the existing mixed laminated board is difficult to manufacture and the product quality and precision need to be improved. question

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  • Mixed laminating board with three-layer HDI (high density interconnect) board and aluminum substrate and manufacturing method thereof
  • Mixed laminating board with three-layer HDI (high density interconnect) board and aluminum substrate and manufacturing method thereof
  • Mixed laminating board with three-layer HDI (high density interconnect) board and aluminum substrate and manufacturing method thereof

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Embodiment Construction

[0024] The present invention provides a mixed laminate of three-layer HDI board and aluminum substrate and its manufacturing method. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for manufacturing a mixed laminate based on a three-layer HDI board and an aluminum substrate in the present invention, as shown in the figure, which includes steps:

[0026] S1, making the double-sided core board into the graphics of the L2 layer;

[0027] S2. Laminate the graphic side of the double-sided core board with the copper foil to form a three-layer HDI board, and bake after lamination;

[0028] S3, carry out copper reducti...

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Abstract

The invention discloses a mixed laminating board with a three-layer HDI (high density interconnect) board and an aluminum substrate and a manufacturing method thereof. The manufacturing method comprises the following steps of A, manufacturing a pattern of an L2 layer on a double-surface core board; B, laminating the pattern surface of the double-surface core board and a copper foil into the three-layer HDI board, and baking; C, performing copper reduction treatment on an L1 layer and an L3 layer of the three-layer HDI board; D, sequentially pre-overlapping the three-layer HDI board, a conductive adhesive and the aluminum substrate, and laminating, so as to obtain the mixed laminating board. The manufacturing method has the advantages that the phenomena of warping, bending and breaking of the HDI board in laminating are effectively avoided; the thickness of each copper layer of the HDI board is greater than or equal to 35mu m; the tolerance after laminating is controlled within + / -0.1mm, the precision of a finished product is improved, and the difficulty in manufacturing is decreased.

Description

technical field [0001] The invention relates to the field of PCB manufacture, in particular to a mixed laminated board of a three-layer HDI board and an aluminum substrate and a manufacturing method thereof. Background technique [0002] HDI board (high-density interconnect circuit board) has the advantages of reducing the area of ​​the circuit board, increasing the assembly density of packaging and electronic parts, increasing the function of the product, reducing the thickness and weight of the board, and the aluminum substrate has good thermal conductivity and heat dissipation. The combination of the two can give full play to their respective advantages, so it has a good application prospect. However, in the prior art, the mixed laminated board of the three-layer HDI board and the aluminum substrate has the following difficulties in the production process: 1. Since the number of layers of the HDI board is an asymmetrical three-layer structure, board warping is easy to occ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4641H05K2203/061
Inventor 付凤奇陆玉婷张飞龙
Owner SHENZHEN KINWONG ELECTRONICS
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