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Preparation method of solar cell

A solar cell and battery technology, applied in the manufacture of circuits, electrical components, final products, etc., to achieve the effects of improving power generation efficiency, easy ohmic contact, and solving hot spot effects

Active Publication Date: 2018-07-27
YINGLI ENERGY CHINA
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  • Abstract
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Problems solved by technology

[0016] The technical problem to be solved by the present invention is to provide a method for preparing a solar cell, which avoids the influence of the bypass diode on the light-receiving area of ​​the solar cell and the module, and at the same time solves the problem of the hot spot effect of the solar cell, improves power generation efficiency, and reduces power generation loss. Extend component operating life

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  • Preparation method of solar cell
  • Preparation method of solar cell
  • Preparation method of solar cell

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Embodiment Construction

[0059] The present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0060] See Figure 5 , Image 6 First, the principle of the method for preparing the solar cell provided by the embodiment of the present invention is described as follows:

[0061] Battery front electrode 1: the positive electrode of the main battery;

[0062] The first electrode on the back 2: The electrical principle is different according to different applications; when the battery is applied to a double-sided glass component, it is the positive electrode of the secondary battery; when the battery is applied to a single-sided glass component, it is the positive electrode of the protective diode;

[0063] The second electrode 3 on the back: the common output electrode of the negative electrode of the main battery and the negative electrode of the secondary battery or the negative electrode of the protection diode.

[0064] The manufacturing method of the s...

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Abstract

The invention discloses a solar cell preparation method, and belongs to the technical field of solar cell preparation. The method mainly comprises the following steps that cleaning is conducted; texturing is conducted; boron diffusion is conducted; regional ion implantation is conducted, wherein the back is divided into a comb-shaped N type region and a comb-shaped P type region; annealing is conducted; laser etching is conducted, wherein PN junctions around a silicon wafer are removed, so that PN junctions of the front and the back are separated, the front adopts the main cell PN junction, and the back adopts the secondary cell or protection diode PN junction; by means of PECVD, the two sides of the silicon wafer are coated with films, and anti-reflection films are formed; silk-screen printing is conducted on the front and the back of the silicon wafer, and a front electrode, a first back electrode and a second back electrode are formed through sintering. Accordingly, the influence caused by a bypass diode on the solar cell and component sunlight area is avoided; meanwhile, the solar cell shot spot effect problem can be solved, the generating efficiency is improved, the power generation loss is lowered, and the component operating life is prolonged.

Description

Technical field [0001] The invention belongs to the technical field of solar cell preparation, and in particular relates to a method for preparing a solar cell. Background technique [0002] Photovoltaic modules are an important part of photovoltaic systems, and solar cells are the core of photovoltaic modules. The structural characteristics, stability, reliability, and differentiation of solar cells directly affect the working state of photovoltaic modules and the design and application of different occasions, and determine the packaging process and technical performance of the modules. [0003] The characteristics of traditional photovoltaic modules produced at home and abroad are: (1) Photovoltaic module products are composed of battery strings, bus bands, packaging materials, and junction boxes; (2) bus belts connect the battery strings and then connect to the junction box (3) The packaging materials include glass, backplane, EVA, aluminum frame, silicone or tape to seal the b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18
CPCH01L31/18Y02P70/50
Inventor 高艳杰张雷王亮王静孙晓娟张建旗田涛高航刘莹任秀强
Owner YINGLI ENERGY CHINA
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