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Method for increasing height of electronic packaging cavity

An electronic packaging and cavity technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of high cost and long shell cycle, and achieve the effect of increasing the height of the cavity and increasing the distance

Active Publication Date: 2017-05-31
NO 47 INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once the height of the original shell cavity is insufficient and the height of the cavity needs to be increased, the shell can only be re-customized
Long period and high cost of re-customizing the shell

Method used

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  • Method for increasing height of electronic packaging cavity
  • Method for increasing height of electronic packaging cavity
  • Method for increasing height of electronic packaging cavity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The process of the method for increasing the height of the electronic packaging cavity in this embodiment is as follows:

[0028] (1) First, a 1.0 μm gold-plated layer is provided on the surface to be welded of the cover plate and the tube seat, and a ring-shaped alloy is preset on the surface to be welded between the metal seal ring and the cover plate and between the metal seal ring and the tube seat. Solder, wherein: the pre-set solder between the cover plate and the metal sealing ring is annular AuSn alloy solder, the mass fraction of Au in the AuSn alloy solder is 80%, and the mass fraction of Sn is 20%; The solder used is ring-shaped AuGe alloy solder, in which the mass fraction of Au is 88%, and the mass fraction of Ge is 12%. Then assemble to form a package body; select the height of the metal sealing ring according to the required height of the package cavity.

[0029] (2) Use fixtures to fix and pre-tighten the tube-shell assembly, and the applied pre-tighten...

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Abstract

The invention discloses a method for increasing the height of an electronic packaging cavity and belongs to the technical field of electronic product airtight packaging. According to the method, a metal sealing ring is arranged between an electronic packaging pipe shell cover plate and a pipe seat, and an assembly body is formed; then welding flux is pre-arranged between the contact face of the cover plate and the contact face of the metal sealing ring and between the contact face of the metal sealing ring and the contact face of the pipe seat, and the assembly body is fixed and pre-tightened through a clamp; and finally the assembly body is welded, and the airtight electronic packaging cavity is formed among the cover plate, the metal sealing ring and the pipe seat. According to the method, the pipe seat and the cover plate are connected through the metal sealing ring, the distance between the pipe seat and the cover plate is increased, and the height of the electronic packaging cavity is increased. By the adoption of the method, in-situ replacement of electronic packaging is achieved on the basis of not changing the size parameters of the length, width and the like and other performance indexes of an original pipe shell.

Description

technical field [0001] The invention relates to the technical field of airtight packaging of electronic products, in particular to a method for increasing the height of an electronic packaging cavity. Background technique [0002] At present, there is no general method in the industry to increase the height of the electronic package shell cavity. For the traditional electronic package ceramic shell, the cavity height is mainly determined by the tube base and the cover plate. After the design is finalized and processed, the cavity height It is determined accordingly. Once the height of the original shell cavity is insufficient and the height of the cavity needs to be increased, the shell can only be re-customized. It takes a long period and high cost to re-customize the shell. Therefore, it is of high economic and practical value to develop a method that can increase the height of the cavity and realize in situ replacement. Contents of the invention [0003] In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30H01L21/50H01L23/10
Inventor 赵鹤然张斌马艳艳
Owner NO 47 INST OF CHINA ELECTRONICS TECH GRP
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