Integrated crystal resonator and processing method thereof

Abstract

The invention discloses an integrated crystal resonator and a processing method thereof. The crystal resonator comprises a resonator wafer base and electrodes. The resonator base is produced by carrying out masking and chemical corrosion on a piezoelectric material. Sunken areas are arranged on the upper surface and the lower surface of the resonator wafer base. An upper electrode and a lower electrode are respectively arranged in the sunken areas. The depths of the sunken areas are greater than the thickness of the upper electrode or the lower electrode. The upper electrode and the lower electrode are equipped with metal lead-out wires at two ends of the resonator wafer base. An upper cover plate and a lower base plate are respectively fixed above the resonator wafer base. Bonding pads are respectively arranged at two ends of the bottom surface of the lower base plate. The bonding pads are connected with the metal lead-out wire of the upper electrode or the lower electrode. The upper cover plate, the lower base plate and the resonator wafer base are produced by the same material. According to the integrated crystal resonator and the method, additional frequency shift can be avoided; a mechanical grinding technology is avoided; a yield is improved; and moreover, the problem that in the prior art, the processing efficiency and the consistency for a small product are relatively low due to adoption of a uniwafer processing method is avoided.

Description

technical field [0001] The invention relates to a crystal resonator, in particular to an integrated crystal resonator and a processing method thereof. Background technique [0002] The existing quartz crystal resonator components are processed into wafers using crystal or other piezoelectric materials, and then electrodes are plated on both sides as vibrators, ceramic or metal shells are used as packages, and conductive glue is used for assembly and electrical connection. [0003] Existing quartz resonators use piezoelectric wafers, which are assembled with ceramic or metal shells, and ceramic bases and cover materials need to be purchased; quartz wafers and ceramic bases have different expansion systems, and the vibrator generates stress when the temperature changes, resulting in additional frequency offset; due to the mechanical grinding process used in the processing of the original wafer, the yield of resonator wafers with higher frequencies is low. Difference. Due to ...

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Problems solved by technology

[0003] Existing quartz resonators use piezoelectric wafers, which are assembled with ceramic or metal shells, and ceramic bases and cover materials need to be purchased; quartz wafers and ceramic bases have different expansion systems, and the vibrator generates stress when the temperature changes, resulting in additional frequency offset; due to the mechanical grinding process used in the processing of the original wafer, the yield of resonator wafers with higher frequencies is low. Difference

Due to the ceramic base process and assembly process, it is more difficult to manufacture resonators with smaller sizes of 1.6×1.2mm and 1.2×1.0mm

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