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Miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler and design method thereof

A half-mode substrate integration and coupler technology, which is applied in the field of couplers, can solve the problems that the conduction characteristics cannot be adjusted twice, the coupling structure of the coupler is single, and the design freedom is low, so as to achieve the controllable phase velocity of the guided wave, good Coupling performance, the effect of controllable operating frequency

Inactive Publication Date: 2017-05-10
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 2. For SIW-based transmission lines, the conduction characteristics such as cut-off frequency and propagation phase velocity are only related to the substrate material and SIW equivalent width
Once the substrate material selection and waveguide size are limited, its conduction characteristics cannot be adjusted twice, and the design freedom is low
[0008] Similarly, many microwave devices based on SIW and HMSIW, such as couplers, also have problems such as large physical size and low degree of design freedom
In addition, the SIW-based coupler has a single coupling structure and lacks design variables to effectively control the coupling coefficient, which has also become one of the bottlenecks in coupler design.

Method used

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  • Miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler and design method thereof
  • Miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler and design method thereof
  • Miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler and design method thereof

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Embodiment 1

[0038] The slow-wave half-mode substrate-integrated waveguide coupler is the SW-HMSIW coupler. Such as figure 1 A miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler as shown, including a dielectric substrate 1, the upper and lower surfaces of the dielectric substrate 1 are metal coatings, and the entire lower surface of the metal coating on the lower surface is used as a ground plane The upper surface is processed and etched by the printed circuit board process, and the shape is two mutually symmetrical and non-contact half-mode substrate integrated waveguide transmission lines 2. The inner side of the half-mode substrate integrated waveguide transmission line 2 is opened with a loading window 4, and the passage through the loading window 4 The PCB is etched into a microstrip multi-segment line network 5, and the microstrip multi-segment line network 5 forms a hollow pattern structure; the outer side of the half-mode substrate integrated waveguid...

Embodiment 2

[0040] This embodiment optimizes the structures of the microstrip polyline network 5 and the loading window 4 on the basis of the above embodiments.

[0041] The loading window 4 is rectangular. The microstrip polyline network 5 includes a plurality of cross-shaped microstrip nodes 51 arranged in sequence along the rectangular loading window, that is, a single-row structure is formed along the horizontal direction. The port is connected with a longitudinal microstrip multi-segment line; the transverse microstrip multi-segment line realizes the connection between two adjacent microstrip nodes 51 and the microstrip nodes 51 at both ends are connected to the half-mode substrate integrated waveguide transmission line 2; the longitudinal microstrip The polyline is connected between the microstrip node 51 and the half-mode substrate integrated waveguide transmission line 2, and the microstrip polyline network 5, the transverse microstrip polyline and the vertical microstrip polyline...

Embodiment 3

[0045] This embodiment is further improved on the basis of the above-mentioned embodiments, that is, there are multiple metallized through holes 7, the metallized through holes 7 are arranged in a row along the loading window 4, and the diameter of the metallized through hole 7 in the center is the smallest and The diameter along the two ends of the connection gradually increases, and different design requirements can replace parameters such as the number and diameter of through holes.

[0046] The electric wall can adopt the existing metallized through-hole array, and also can adopt the metallized through-groove.

[0047] The coupler includes an input terminal 81 , a through output terminal 82 , a coupling output terminal 84 and an isolation terminal 83 . The two ends of the half-mode substrate-integrated waveguide transmission line 2 are respectively connected to the input terminal 81 and the straight-through output terminal 82 through the trapezoidal microstrip transition s...

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Abstract

The invention discloses a miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler and a design method thereof. An open edge of a half-mode substrate-integrated waveguide transmission line is utilized as a coupling part of the coupler and a microstrip multistage line network is formed by etching on the surface to replace a novel coupler structure formed by a traditional metal surface. Compared with a traditional substrate-integrated waveguide coupler, the miniaturized broadband slow-wave half-mode substrate-integrated waveguide coupler has the advantages that a slow wave effect is formed by introducing a microstrip multistage line into an inductive load, so that the physical size of a coupling edge is effectively reduced; the coupling characteristic of the coupler can be sensitively affected by a multi-parameter adjustable microstrip multistage line structure and the coupling coefficient and the coupling bandwidth can be more flexibly and effectively controlled; meanwhile, a new design freedom is provided for optimization of various performance indexes of the coupler by multiple parameters with adjustable structure sizes in the microstrip multistage line; and compared with a traditional substrate-integrated waveguide coupler, the formed novel coupler has a lower profile, a larger working bandwidth and better coupling performance.

Description

technical field [0001] The invention relates to the field of couplers, in particular to a miniaturized broadband slow-wave half-mode substrate integrated waveguide coupler and a design method thereof. Background technique [0002] In recent years, with the rapid development of microwave and millimeter wave communication systems, substrate integrated waveguide (SIW) technology has attracted widespread attention due to its low cost and complete planar circuit structure. As a new type of planar waveguide structure, the substrate integrated waveguide not only has the characteristics of low loss, high power capacity, and adaptability to high-frequency frequency bands of the traditional metal rectangular waveguide, but also overcomes the characteristics of the traditional waveguide structure, which is too large and difficult to process. The structure miniaturization and easy processing and integration are realized. [0003] The substrate-integrated waveguide is a waveguide struct...

Claims

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Application Information

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IPC IPC(8): H01P5/18H01P11/00
CPCH01P5/184H01P11/00
Inventor 金海焱周瑜亮金海陆黄永茂廖丹
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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