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A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it

A technology of polyphenylene ether resin and composition, applied in thermoplastic polymer dielectrics, printed circuits, printed circuits, etc., can solve the problems of poor thermal oxidation resistance, low dielectric constant, low dielectric loss, etc. The effect of thermo-oxidative aging performance, low dielectric constant and low dielectric loss

Inactive Publication Date: 2018-11-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The above prior art has the following problems: in order to obtain lower dielectric constant and lower dielectric loss, it is necessary to increase the use ratio of vinyl resin crosslinking agent such as polybutadiene
Although the prepared substrate has a lower dielectric constant and lower dielectric loss, the acrylate groups of the bifunctional acrylate-based modified thermosetting polyphenylene ether resin are limited, and the excess vinyl resin cannot Cross-linking agents such as polybutadiene side chain double bonds react completely
Incompletely reacted vinyl resin crosslinking agents such as polybutadiene side chain double bonds have poor thermal and oxidative aging resistance, which seriously affects the stability of the dielectric constant and dielectric loss of the substrate during long-term use, thereby making the substrate The signal integrity performance deteriorates and cannot meet customer needs

Method used

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  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it
  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it
  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] The curing initiator DCP of the styrene-butadiene copolymer Ricon100 of 50g parts by weight of the four-functional methyl methacrylate group modified thermosetting polyphenylene ether resin PPO-1 of 20g parts by weight, 1.5 parts by weight, is dissolved in toluene solvent and adjust to a suitable viscosity. Soak the glue with 2116 glass fiber cloth, pass the clamping shaft to control the suitable single weight, and dry the sheet in an oven to remove the toluene solvent to obtain the 2116 adhesive sheet. Overlap four pieces of 2116 adhesive sheets, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90min, and the curing pressure is 50Kg / cm 2 , the curing temperature is 200°C, and the high-speed electronic circuit substrate is prepared. The physical properties are shown in Table 2.

Embodiment 2

[0091] The curing initiator DCP of the styrene-butadiene copolymer Ricon100 of the four-functional methyl methacrylate group modified thermosetting polyphenylene ether resin PPO-1 of 30 g parts by weight of 50 parts by weight, 1.5 parts by weight, is dissolved in toluene solvent and adjust to a suitable viscosity. Soak the glue with 2116 glass fiber cloth, pass the clamping shaft to control the suitable single weight, and dry the sheet in an oven to remove the toluene solvent to obtain the 2116 adhesive sheet. Overlap four pieces of 2116 adhesive sheets, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90min, and the curing pressure is 50Kg / cm 2 , the curing temperature is 200°C, and the high-speed electronic circuit substrate is prepared. The physical properties are shown in Table 2.

Embodiment 3

[0093] 50g parts by weight of the four-functional methyl methacrylate-based modified thermosetting polyphenylene ether resin PPO-1, 50 parts by weight of the styrene-butadiene copolymer Ricon100, 1.5 parts by weight of the curing initiator DCP, dissolved in toluene solvent and adjust to a suitable viscosity. Soak the glue with 2116 glass fiber cloth, pass the clamping shaft to control the suitable single weight, and dry the sheet in an oven to remove the toluene solvent to obtain the 2116 adhesive sheet. Overlap four pieces of 2116 adhesive sheets, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90min, and the curing pressure is 50Kg / cm 2 , the curing temperature is 200°C, and the high-speed electronic circuit substrate is prepared. The physical properties are shown in Table 2.

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Abstract

The present invention relates to a polyphenylene ether resin composition and a prepreg and a laminate containing it. The polyphenylene ether resin composition comprises the following components: (1) acrylate-based modified thermosetting polyphenylene ether resin with four or more functions; The weight of the above acrylate-based modified thermosetting polyphenylene ether resin is 100 parts by weight, and the weight of the vinyl resin crosslinking agent is 40-100 parts by weight. Since the modified thermosetting polyphenylene ether resin contains four or more functional acrylate active groups, it can cross-link more vinyl resin cross-linking agents, and the prepared high-speed electronic circuit substrate not only has a low dielectric constant And dielectric loss, and the side chain double bond of the vinyl resin crosslinking agent reacts completely in the resin curing system, so that the high-speed electronic circuit substrate has better thermal and oxygen aging resistance.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a polyphenylene ether resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity of information, and the high frequency and high speed of transmission signals have been applied to high-end communication network hardware equipment such as routers, switches, and servers. The transmission lines of electronic circuit boards used by etc. are getting longer and longer, requiring electronic circuit substrates to have lower dielectric constant and lower dielectric loss. [0003] For high-speed electronic circuit substrates, maintaining the stability of the dielectric constant and dielectric loss of the substrate during long-term use will hav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L25/10C08L47/00C08K7/00C08K7/14C08K3/36B32B27/28H05K1/03
CPCB32B27/285C08L71/12H05K1/0353C08L2201/08C08J5/244C08J5/249C08L25/10C08K7/00C08K7/14C08K3/36C08L9/06H05K1/034H05K1/0366H05K2201/0129C08J2409/00C08J2409/06C08J2371/12C08J2425/10C08L71/126H05K1/0373H05K2201/012H05K2201/015B32B2264/0214B32B2307/204B32B2250/05B32B2307/3065B32B2264/101B32B2264/107B32B2264/102B32B2260/046B32B2262/101B32B2264/10B32B5/02B32B5/26B32B2457/08B32B2264/104B32B2264/12B32B2260/021B32B15/20B32B15/14B32B2264/0257C08L9/00B32B27/00B32B2305/076C08J2325/10C08J2447/00C08J2471/12C08L2312/02
Inventor 陈广兵曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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