Shock wave excitation apparatus capable of realizing excitation of MEMS microstructure in vacuum environment

Abstract

The invention discloses a shock wave excitation apparatus capable of realizing excitation of a MEMS microstructure in a vacuum environment. The shock wave excitation apparatus comprises a substrate; a hand-operated triaxial displacement bench and a support are arranged on the substrate; a needle electrode unit pointing to a microstructure unit is arranged on a Z-axis slide carriage of the hand-operated triaxial displacement bench; the microstructure unit comprises an installation sleeve; an elastic pedestal is arranged on one end in an installation hole of the installation sleeve via press mounting; the elastic pedestal is in the shape of a circular ring slice and an annular boss is arranged at the central part of the elastic pedestal; a plate electrode is inlaid in the elastic pedestal via an insulation sleeve; the MEMS microstructure is mounted on the inner side of the elastic pedestal; an optical glass plate is arranged in on the other end in the installation hole via press mounting; the outer wall of the installation sleeve is provided with a vacuum joint along a radial direction; the needle electrode and the plate electrode are electrically connected with two poles of a high-voltage capacitor respectively; and the two poles of the high-voltage capacitor are electrically connected with the positive and negative electrodes of a high-voltage supply respectively. The shock wave excitation apparatus is firm in structure installation, simple and safe to operate and convenient for testing of the dynamic behavior parameters of the microstructure in the vacuum environment.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a shock wave excitation device capable of exciting MEMS microstructures in a vacuum environment. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it ...

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Problems solved by technology

However, the device still has the following disadvantages: first, a cross spring is used in the device as a base structure for carrying microstructures, and the microstructure and its installation structure are bonded to the top center of the cross spring. When the structure is excited, the cross spring will produce a large bending deformation; on the one hand, this will cause the deformation of the microstructure mounting plate, resulting in damage to the microstructure; on the other hand, this will make the gap between the microstructure mounting plate and the cross spring The cured glue between them bears a lot of tension. After multiple excitations, the glue is easy to crack, and the microstructure mounting plate will loosen and break away from the cross spring piece; secondly, in the device, the cross spring piece, ceramic piece and plate The electrodes are stacked up and down, and are fixed by glue bonding between two adjacent parts. This bonding structure is not strong enough. After multiple discharges, the layers are easy to separate from each other; Third, in the device, the feeding mechanism can only be adjusted manually, and cannot realize automatic feeding, resulting in cumbersome discharge operation and poor safety; fourth, since the microstructure is completely exposed to the air, when it is necessary to test the microstructure in a vacuum environment When the dynamic characteristics are lower, the device cannot meet the demand because it cannot be discharged in a vacuum environment.

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