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Method for eliminating high temperature fault of antiskid brake control device

A technology of anti-skid brakes and control devices, applied in the direction of program control, general control system, control/regulation system, etc., can solve the problems of increased weight, limited product weight, expensive thermal conductivity materials, etc., to save resources and energy, eliminate Effects of high temperature failure and improved heat dissipation

Inactive Publication Date: 2017-03-29
XIAN AVIATION BRAKE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] 1) The cost of selecting high temperature resistant components is too high;
[0025] 2) Domestic anti-skid brake control devices are currently closed shells, and shells with ventilation holes cannot be used;
[0026] 3) Materials with good thermal conductivity are expensive and unrealistic;
[0027] 4) Installing a cooling fan will increase the weight, and civil aviation has restrictions on the weight of the product

Method used

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  • Method for eliminating high temperature fault of antiskid brake control device
  • Method for eliminating high temperature fault of antiskid brake control device
  • Method for eliminating high temperature fault of antiskid brake control device

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Embodiment Construction

[0072] This embodiment is to improve the design of a high-temperature weak link of a civil aircraft anti-skid brake control device. The high-temperature weak link is a component that exceeds 100°C under the condition of an ambient temperature of 70°C. The invention adopts the design measures of improving the heat dissipation capacity, and prolongs the service life of the antiskid brake control device under high temperature conditions.

[0073] The purpose of this embodiment is that when the ambient temperature is 70°C and the anti-skid brake control device is working, the temperature of the casing and all components is lower than 100°C, so as to ensure that all components can work normally during use.

[0074] The technical solution of this embodiment is to adopt heat dissipation design measures for the housing and component layout of the anti-skid brake control device to improve the heat dissipation capacity of the anti-skid brake control device and achieve the purpose of redu...

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Abstract

The invention relates to a method for eliminating the high temperature fault of an antiskid brake control device. With the method adopted, the heat dissipation capacity of the antiskid brake control device can be improved under a condition that a shell material is not changed, so that the surface temperature of the shell of the antiskid brake control device can be lower than 100 Celsius degrees under a 70-Celsius degree high-temperature environment and a working condition. Heat dissipation measures are taken under a condition that the 125-Celsius degree rated temperature of existing high-temperature components is not changed, so that the components can work below 100 Celsius degrees. The cost of improvement is lower than the cost of redesign, energy can be saved, and consumption can be reduced. Aluminum is used to manufacture the shell, and heat dissipation grooves are machined in the shell, an installation height between an antiskid brake control device installation surface and an aircraft is increased, and therefore, the heat dissipation capacity of the shell and the antiskid brake control device installation surface can be enhanced, and high temperature faults generated when the antiskid brake control device is used for a long time under the 70-Celsius degree high-temperature environment can be eliminated.

Description

technical field [0001] The invention relates to the field of high-temperature fault analysis of civil transport aircraft electronic products, in particular to a method for eliminating high-temperature faults of an anti-skid brake control device. Background technique [0002] The high temperature of electronic components at home and abroad is generally 125°C, and the ambient temperature reaches 70°C. Due to the heat generated by the operation of electronic products, it is measured that it exceeds 125°C, and high temperature failures will occur at this time. To eliminate failures of electronic products under high temperature conditions, design improvements that increase heat dissipation are required. [0003] The anti-skid brake control device is an accessory of the aircraft anti-skid brake system. It is powered by the aircraft, receives the electrical signal of the wheel speed sensor, and controls the brake pressure during the anti-skid brake process. It can complete the norm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B23/02
CPCG05B23/0218G05B2219/24015
Inventor 乔建军乔子骅陈志军
Owner XIAN AVIATION BRAKE TECH
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