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Photo-thermal dual-curing shielding glue and preparation method thereof

A dual-curing and heat-curing technology, applied in the field of chemical materials, can solve the problems of overflowing glue and incomplete curing, and achieve the effects of improving strength, drop resistance and high shielding

Active Publication Date: 2017-03-15
广州惠利电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide a photothermal dual-curing masking glue for the above problems. Using this masking glue, it can be pre-fixed with UV, and then heated and cured completely, so that the glue can be applied on the edge of the touch glass or LCD, and Overcome the problems of overflowing glue and incomplete curing

Method used

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  • Photo-thermal dual-curing shielding glue and preparation method thereof
  • Photo-thermal dual-curing shielding glue and preparation method thereof
  • Photo-thermal dual-curing shielding glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A photothermal dual curing masking glue prepared from raw materials:

[0045] Oligomers: 48.0 g in total.

[0046] Epoxy acrylate 48.0 g.

[0047] Active monomer: 43.6 g in total.

[0048] The active monomer of monofunctional acrylate, isobornyl acrylate (IBOA) 24.2g,

[0049] Active monomer of polyfunctional acrylate, ditrimethylolpropane triacrylate 19.4g.

[0050] Photoinitiator: 3.9 g in total.

[0051] 3.9 g of 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinebenzylphenyl)butanone.

[0052] Thermal initiator: 2.3 g in total.

[0053] 2.3 g of tert-butyl peroxy-2-ethylhexanoate.

[0054] Toner: 0.4g in total.

[0055] 0.4 g of carbon black.

[0056] Additives: 1.8g in total.

[0057] Adhesion promoter (2-hydroxyethyl methacrylate phosphate) 1.0g,

[0058] Defoamer (silicone defoamer, model BYK-066N) 0.3g,

[0059] Leveling agent (organic silicon leveling agent, the model is SIVEL 5525) 0.2g,

[0060] Dispersant (modified polydimethylsiloxane, model is BYK-160...

Embodiment 2

[0074] A photothermal dual curing masking glue prepared from raw materials:

[0075] Oligomer: 50.0 g in total.

[0076] Polyester acrylate 50.0 g.

[0077] Active monomer: a total of 41g.

[0078] The active monomer of monofunctional acrylate, isobornyl acrylate (IBOA) 18.2g,

[0079] Active monomer of difunctional acrylate, 1,6-hexanediol diacrylate 13.8g

[0080] Active monomer of multifunctional acrylate, dipentaerythritol pentaacrylate 9.0g.

[0081] Photoinitiator: 3.9 g in total.

[0082] 3.9 g of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.

[0083] Thermal initiator: 2.3 g in total.

[0084] Tert-butyl peroxybenzoate 2.3g.

[0085] Toner powder: 0.5g in total.

[0086] 0.5 g of carbon black.

[0087] Additives: 2.3g in total.

[0088] Adhesion promoter (2-hydroxyethyl methacrylate phosphate) 1.0g,

[0089] Adhesion promoter (γ-methacryloxypropyltriethoxysilane) 0.5g,

[0090] Defoamer (silicone defoamer, model BYK-066N) 0.3g,

[0091] Leveling agent (o...

Embodiment 3

[0106] A photothermal dual curing masking glue prepared from raw materials:

[0107] Oligomers: 55.6 g in total.

[0108] Pure acrylate 55.6g.

[0109] Active monomer: 32.1 g in total.

[0110] The active monomer of monofunctional acrylate, isobornyl acrylate (IBOA) 8.3g,

[0111] Active monomer of difunctional acrylate, tripropylene glycol diacrylate 11.8g,

[0112] Active monomer of multifunctional acrylate, 12.0 g of dipentaerythritol pentaacrylate.

[0113] Photoinitiator: 2.5g in total.

[0114] 2.5 g of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0115] Thermal initiator: 2.5 g in total.

[0116] Tert-butyl peroxybenzoate 2.5g.

[0117] Toner: 2g in total.

[0118] Carbon black 2g.

[0119] Additives: 5.3g in total.

[0120] Adhesion promoter (2-hydroxyethyl methacrylate phosphate) 1.6g,

[0121] Adhesion promoter (multifunctional thiol compound PE-1) 2.5g,

[0122] Defoamer (silicone defoamer, model BYK-066N) 0.4g,

[0123] Leveling agent (organic s...

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Abstract

The invention relates to photo-thermal dual-curing shielding glue and a preparation method thereof, and belongs to the technical field of chemical materials. The photo-thermal dual-curing shielding glue is mainly prepared from, by weight, 40-70 parts of low polymer, 30-60 parts of activated monomer, 2-8 parts of photo-initiators, 1-5 parts of thermal initiators, 0.1-4 parts of toners and 0.1-10 parts of auxiliaries. The low polymer is at least one of epoxy acrylate, pure acrylic ester and polyester acrylate, and the activated monomer is at least one of mono-functional acrylic ester, bifunctional acrylic ester and poly-functional acrylic ester. The shielding glue can adopt a photo-thermal dual-curing mode, UV (ultraviolet) pre-curing shaping is performed, complete heating and curing are performed, and batch treatment is performed within a certain proper time. The shortcomings of serious excessive glue caused by only heating and curing or normal-temperature curing and incompleteness of only UV curing are overcome. The photo-thermal dual-curing shielding glue can be widely used for touch glass, LCD (liquid crystal display) modules and cover glass shading and enhancement.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a photothermal dual curing masking glue and a preparation method thereof. Background technique [0002] At present, narrow-edge mobile phones bring a higher screen-to-body ratio, allowing the mobile phone to integrate a larger display in a smaller body size, bringing better visual effects and user experience, while improving portability. Edge mobile phones have become the common pursuit of businesses and consumers. [0003] However, since liquid crystal molecules cannot emit light by themselves, in order to display images, the LCD screen needs a backlight source to provide light. There will be some errors during the assembly of the mobile phone, and absolute alignment cannot be achieved, and there is a certain fit tolerance. When the screen assembly error is large, the BM (black border) area cannot be effectively blocked, which will cause light leakage, and when the ...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D7/12
CPCC09D4/00C09D7/61C09D7/63C09D7/65
Inventor 于爱霞杨裕泉黄仁杰陈梓东李利华
Owner 广州惠利电子材料有限公司
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