Laser tin soldering machine

Abstract

The invention provides a laser tin soldering machine which comprises a machine table body, a focusing mirror, a temperature inductor, a laser device, a soldering flux frame, a CCD monitor probe, a control device, a feeding device and a machining head fixing plate. The machining head fixing plate is arranged at the upper end of the machine table body. The laser device is arranged at the middle position of the machining head fixing plate. The CCD monitor probe is arranged on the left side of the fixing plate. The temperature inductor is arranged on the right side of the machining head fixing plate and is fixed in a bevel manner. The focusing mirror is arranged at the lower end of a laser. The soldering flux frame is arranged on the plane of the upper end of the left side of the machining head fixing plate. The feeding device is arranged at the lower end of the soldering flux frame. The control device is arranged at the upper end of the machine table body. According to the laser tin soldering machine, an electrical structure is used for control, solder wires, a triaxial working table, lasers are controlled, and therefore high precision and remote soldering are achieved, the service life is long, and the laser tin soldering machine is reasonable in design, simple in structure, reliable in operation and easy to operate.

Description

technical field [0001] The invention relates to the technical field of laser equipment, in particular to a laser soldering machine. Background technique [0002] Currently on the market, wave soldering, reflow soldering, immersion soldering, direct spot welding with ordinary welding guns and other methods are commonly used to solder circuit boards, wires, electronic devices, and microelectronics; [0003] Generally, welding is to heat circuit boards, wires, and electronic devices through high-temperature airflow, or high-temperature liquid, or high-temperature solid heat conductors for all workpieces or large-scale or individual individual heating (the minimum heating area is greater than 3 square millimeters), so that The nearby solder (including various tin materials or other metal powders) usually becomes fluid or liquid with the help of flux, which physically connects the pins, terminals and targets of electronic components, and forms adhesion welding after cooling. [...

AI Technical Summary

Problems solved by technology

[0012] 1. Solve the problem that the entire workpiece (two welding objects) is heated to the welding temperature point during traditional welding, and change the large-area heating welding to the welding of extremely small points;

[0013] 2. Solve the problem that the energy output cannot be precisely controlled at a fixed point;

[0014] 3. Solve the problem of stress in the welding process;

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