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Flexible pressure sensor and manufacturing method thereof

A technology of a pressure sensor and a manufacturing method, which is applied in the field of pressure sensors, can solve the problems of high cost, high technical difficulty and high equipment dependence, and achieves the effects of low cost, improved sensitivity and reliability, and simple and convenient manufacturing method.

Active Publication Date: 2017-02-01
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned technologies all apply microstructure arrays to flexible pressure sensors, their microstructure arrays are all based on the silicon microtemplate method; and the fabrication of silicon microtemplates usually requires the use of microelectromechanical systems (MEMS) processing technology , involving a series of complex processes such as etching, bonding, photolithography, oxidation, diffusion, sputtering, etc. Although this technology can achieve accurate and mass production of microstructure arrays, it has disadvantages such as high equipment dependence, technical difficulty, and high cost

Method used

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  • Flexible pressure sensor and manufacturing method thereof
  • Flexible pressure sensor and manufacturing method thereof
  • Flexible pressure sensor and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] figure 1 is a schematic structural view of the flexible pressure sensor according to Embodiment 1 of the present invention.

[0030] Such as figure 1 As shown, the flexible pressure sensor according to this embodiment includes two electrode structures 1 oppositely arranged, each electrode structure 1 includes a flexible substrate 11 and a conductive layer 12 arranged on the flexible substrate 11, the two electrode structures 1 The conductive layers 12 are connected against each other; each flexible substrate 11 includes a substrate body 111 and a plurality of convex structures 112 disposed on the substrate body 111, and the conductive layer 12 covers the flexible substrate 11 On the surface with multiple convex structures 112, a complete flexible pressure sensor is formed.

[0031] In each flexible substrate 11, a plurality of protruding structures 112 are preferably integrally formed with the substrate body 111; at the same time, the conductive layer 12 completely co...

Embodiment 2

[0040] In the description of Embodiment 2, the similarities with Embodiment 1 will not be repeated here, and only the differences with Embodiment 1 will be described. refer to Figure 4 , the difference between embodiment 2 and embodiment 1 is that the arrangement of the plurality of protruding structures 112 in the two flexible substrates 11 is different; in this embodiment, the protruding structures 112 in the two flexible substrates 11 are mutually Cross arrangement. For the rest, referring to the structure and materials in Example 1, another flexible pressure sensor was obtained.

[0041] The flexible pressure sensor of this embodiment is tested by the same test method as in the above-mentioned embodiment 1. When the plurality of convex structures 112 in the flexible pressure sensor of this embodiment are subjected to an external pressure F, the following Figure 5 deformation shown. From Figure 5 It can be seen from the figure that although the convex structures 112...

Embodiment 3

[0043] This embodiment discloses the manufacturing method of the flexible pressure sensor in the above-mentioned embodiment 1, specifically refer to Figure 6-Figure 11 , the manufacturing method of the flexible pressure sensor according to the present embodiment includes the following steps:

[0044] Q1, select a substrate 41, and prepare a plurality of bumps 42 on the substrate 41; wherein, the shape and arrangement of these bumps 42 are the same as the shapes of the plurality of convex structures 112 in the flexible pressure sensor in Example 1 and arranged in the same way, such as Figure 6 shown.

[0045] In this embodiment, the material of the substrate 41 is glass, and the material of the bumps 42 is polystyrene (abbreviated as PS); the shape of the bumps 42 is preferably spherical, and its particle size is controlled to be 100 nm to 1 mm. Preferably it is 20 μm.

[0046] Of course, the material of the substrate 41 can also be a silicon chip or a smooth plastic produ...

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Abstract

The invention discloses a flexible pressure sensor, which comprises two oppositely-arranged electrode structures, wherein each electrode structure comprises a flexible substrate and a conductive layer arranged on the flexible substrate; the conductive layers of the two electrode structures are connected in a mutually-facing abut joint mode; the flexible substrate comprises a substrate body and multiple convex structures arranged on the substrate body; and the conductive layer covers the surface, with the multiple convex structures, of the flexible substrate. According to the flexible pressure sensor disclosed by the invention, by using the characteristic that the inner multiple convex structures formed by a flexible material are likely to deform under a pressure effect, resistance changes, adjustment and control caused by contact area changes when the two conductive layers in the opposite electrode structures make contact can be realized, and thus, pressure sensing is realized. The invention also discloses a method of manufacturing the above flexible pressure sensor. Compared with an MEMS processing process generally adopted by the flexible pressure sensor in the prior art, the manufacturing method of the invention is simple and convenient, and the cost is lower.

Description

technical field [0001] The invention belongs to the technical field of pressure sensors, and in particular relates to a flexible pressure sensor and a manufacturing method thereof. Background technique [0002] Flexible pressure sensor is a flexible electronic device that can convert stress into electrical signal, which can be widely used in flexible touch screen, artificial intelligence, wearable electronics, mobile medical and other fields. [0003] According to the signal conversion mechanism, pressure sensors are mainly divided into resistive sensors, capacitive sensors and piezoelectric sensors. Among them, the basic working principle of the resistive pressure sensor is to convert the change of the measured pressure into the change of the resistance value of the sensor. Resistive pressure sensors have attracted much attention due to their advantages such as simple device structure, stable and easy-to-measure resistance signal, and high sensitivity. Microstructuring th...

Claims

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Application Information

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IPC IPC(8): G01L1/18
CPCG01L1/18
Inventor 胡友根孙蓉赵涛朱朋莉梁先文朱玉张愿
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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