A device for removing the diamond wire cutting damage layer on the surface of polycrystalline silicon wafer
A technology of diamond wire cutting and polysilicon wafers, which can be applied to used abrasive processing devices, metal processing equipment, and cleaning methods using gas flow, etc., and can solve problems such as inability to effectively remove damaged layers, high cost, and complicated process flow
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[0016] Such as figure 1 As shown, the removal device of the diamond wire cutting damage layer on the surface of the polycrystalline silicon wafer includes a bracket 1, a headless belt 2, a driving wheel 3, and a driven wheel 4, and the driving wheel 3 and the driven wheel 4 are fixed on the bracket 1 through bearings, Described headless belt 2 walks around driving wheel 3, driven wheel 4 and is tightened by driving wheel 3 and driven wheel 4, is connected with the drive motor 5 that is used to drive driving wheel 3 to rotate on described bracket 1, and described endless belt 2. It is arranged horizontally and a support platform 6 is provided between the headless belt 2 on the upper layer and the headless belt 2 on the lower floor. The support platform 6 is fixed on the support 1 through a support rod. The surface is a smooth plane, and the headless belt 2 located on the upper layer is in contact with the upper surface of the support platform 6, and the two end faces of the sup...
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