A tube-band microcirculation radiator and a microcirculation heat exchange system

Abstract

The invention discloses a corrugated tube type micro-circulation radiator and a micro-circulation heat exchange system, comprising a heat source module mounting plate, a radiator mounting plate and a plurality of micro-circulation radiator modules, wherein the heat source module mounting plate and the radiator mounting plate are mutually fixed; a main working medium cavity for accommodating working mediums forms in the heat source module mounting plate; secondary working cavities form in all micro-circulation radiator module; the secondary working cavities are connected with the main working medium cavity; radiating fins are arranged on the outer walls of the micro-circulation radiator modules; a main fluid absorption micro-channel with a capillary structure is arranged on the inner wall of the main working medium cavity; secondary fluid absorption channels with the capillary structure are arranged on the micro-circulation radiator modules; the main fluid absorption micro-channel is interconnected with capillary channels of the secondary fluid absorption channels. The corrugated tube type micro-circulation radiator and the micro-circulation heat exchange system have the advantages of compact structure, high transmission efficiency, relatively low noise, low auxiliary power consumption and high reliability and can well solve the main bottleneck problem in industrial development of electronic components, and thus the radiator and the system have bright market prospects.

Description

technical field [0001] The invention relates to a radiator, in particular to a tube-and-belt microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirem...

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Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the condition of high power and high heat flux density, and researches and designs a tube-and-belt microcirculation radiator and a microcirculation heat exchange system

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