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OLED display device and manufacturing method thereof

A technology for a display device and a manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as device failure, achieve the effects of improving adhesion, increasing contact area, and reducing the probability of falling off

Active Publication Date: 2019-04-30
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Studies have shown that water vapor and oxygen will have a great impact on the performance of OLED devices. One is that water vapor and oxygen may react with the cathode material of silver (Ag) and magnesium (Mg); the other is that water vapor and oxygen may react with air. A chemical reaction occurs between the hole transport layer and the electron transport layer, causing device failure

Method used

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  • OLED display device and manufacturing method thereof
  • OLED display device and manufacturing method thereof
  • OLED display device and manufacturing method thereof

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Embodiment Construction

[0031] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0032] see figure 2 , the present invention provides an OLED display device, comprising a substrate 100, an OLED device 200 disposed on the substrate 100, and a thin film encapsulation layer 300 disposed on the OLED device 200 and the substrate 100 and covering the OLED device 200 ;

[0033] The thin-film encapsulation layer 300 includes a plurality of intermediate encapsulation units 310 stacked, and a top inorganic barrier layer 320 disposed on the uppermost intermediate encapsulation unit 310, each intermediate encapsulation unit 310 includes an intermediate inorganic barrier layer 311, and an organic buffer layer 312 disposed on the intermediate inorganic barrier layer 311;

[0034] In the thin film encapsulation layer 300, the upper su...

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PUM

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Abstract

The invention provides an OLED display device and a manufacturing method thereof. A mask plate provided with a plurality of openings is used to shield and form an intermediate inorganic barrier layer in a thin film encapsulation layer, so that the upper surface of the intermediate inorganic barrier layer has a plurality of evenly distributed The raised portion increases the contact area between the organic buffer layer covering the upper surface of the intermediate inorganic barrier layer and the intermediate inorganic barrier layer, improves the adhesion between the intermediate inorganic barrier layer and the organic buffer layer at the interface, and greatly reduces the thickness of the inorganic barrier layer. At the same time, the raised portion can block the movement of water and oxygen molecules at the interface between the intermediate inorganic barrier layer and the organic buffer layer, preventing water and oxygen molecules from continuing to invade the OLED display device. Efficiency of OLED devices.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display device and a manufacturing method thereof. Background technique [0002] In recent years, flat panel display devices such as Liquid Crystal Display (LCD) devices and Organic Light Emitting Diode (OLED) display devices have gradually replaced CRT displays and become mainstream products in the display device market. Among them, OLED display devices have many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, near 180° viewing angle, wide operating temperature range, flexible display and large-area full-color display, etc. , is recognized by the industry as the most promising display device. [0003] An OLED display device generally includes: a substrate, an encapsulation cover plate disposed opposite to the substrate, an anode disposed on the substrate, a hole injection layer disp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K50/844H10K71/00
Inventor 王杲祯余威
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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