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Sintering process of super thick large-sized LTCC substrate based on silver system material

A large-scale, systematic technology, applied in the field of sintering technology, can solve problems such as unqualified flatness of the substrate, open circuit of the circuit network, etc., achieve the effect of shortening the sintering time, reducing the probability of open circuit failure, and reducing the sintering time

Inactive Publication Date: 2017-01-11
NORTH ELECTRON RES INST ANHUI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a sintering process based on an ultra-thick and large-size LTCC substrate based on silver-based materials, aiming to solve the problem of circuit network open circuit, substrate Phenomena such as unqualified flatness

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  • Sintering process of super thick large-sized LTCC substrate based on silver system material
  • Sintering process of super thick large-sized LTCC substrate based on silver system material

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0029] The technical scheme of the patent application for the present invention is:

[0030] 1) When designing the process, consider the thickness and size of the substrate, and increase the deglue time appropriately;

[0031] 2) Considering the activity of Ag ions, the sintering time above 450°C should be appropriately shortened;

[0032] 3) In order to facilitate the discharge of sintering gas, the sintering support is made of porous alumina;

[0033] 4) Combined with the specific number of layers, size, and whether the product contains cavities, make appropriate adjustments to the five temperature zones of the sintering curve.

[0034] This discovery is mainly applicable to the sintering o...

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Abstract

The invention discloses a sintering process of a super thick and large-sized LTCC substrate based on a silver system material. The material is characterized by conducting sintering for the super thick large-sized LTCC substrate of the silver system material in temperature raising period, glue discharging period, secondary temperature raising period and peak value sintering period according to sintering curve set by the settings. Compared with common super thick and large-sized LTCC sintering curve, the sintering process of the super thick and large-sized LTCC substrate based on the silver system material remarkably reduces sintering time, and can effectively reduce the rate of substrate open circuit failure, meanwhile, due to shorter sintering time, production efficiency is increased; performances of the substrate as flatness, shrinkage rate and density after sintering all meet the product requirements; the sintering curve is stable, wide in application and suitable for sintering the super thick and large-sized LTCC substrate based on an Au / Ag mixed system.

Description

technical field [0001] The invention relates to a sintering process of an ultra-thick and large-size LTCC substrate based on a silver system material, and belongs to the technical field of LTCC substrate production. Background technique [0002] LTCC (Low Temperature Co-fired Ceramics) substrate has remarkable characteristics such as high three-dimensional wiring density, embedded integrated components, good high-frequency transmission performance, strong environmental adaptability, and high long-term reliability. It has become a typical advanced substrate for modern microelectronic components. The more layers, the deeper the cavity, and the larger the size of the LTCC substrate, the greater the degree of freedom for three-dimensional high-density integration, and the better the application prospect. [0003] Sintering is a characteristic process of LTCC, and all chemical reactions are completed during sintering, which determines the quality and quality of LTCC substrates. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/64
CPCC04B35/64C04B2235/6562C04B2235/661
Inventor 高亮李冉展丙章濮嵩高晓佳
Owner NORTH ELECTRON RES INST ANHUI CO LTD
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