Polycrystalline silicon ingot casting process based on boron nitride coating
A technology of polysilicon ingot casting furnace and boron nitride, which is applied in the direction of polycrystalline material growth, crystal growth, chemical instruments and methods, etc., can solve the problem that the annealing effect affects the stress distribution of the finished ingot, the quality of the finished polysilicon ingot is greatly affected, The quality of the finished ingot is greatly affected, and the coating process is easy to control, the drying structure design is reasonable, and the cost is low.
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Embodiment 1
[0054] like figure 1 A kind of polysilicon ingot technology based on boron nitride coating as shown, comprises the following steps:
[0055] Step 1, preparation of the coating on the bottom of the crucible, the process is as follows:
[0056] Step 101, preparation of coating spraying liquid: uniformly mixing organic binder, deionized water and boron nitride at a mass ratio of 1:2.2:1 to obtain coating spraying liquid;
[0057] Step 102, spraying: use spraying equipment to evenly spray the coating spray liquid described in step 101 on the inner bottom surface of the crucible 1, and the inner bottom surface of the crucible 1 is 1 m 2 The mass of boron nitride contained in the coating spray liquid sprayed in the area is 100g-150g;
[0058] The crucible 1 is a quartz crucible for a polysilicon ingot furnace;
[0059] Step 103, drying: place the crucible 1 in step 102 horizontally in the drying equipment, and use the drying equipment to spray the coating sprayed on the inner bot...
Embodiment 2
[0107] In this embodiment, the difference from Embodiment 1 is: during the preheating process in step 202, the heating power of the ingot furnace is gradually increased to P1, where P1=50kW~100kW; After all the silicon material is melted, the heating power variation of the ingot furnace is observed, and the melting process is completed after the heating power of the ingot furnace drops to P2 and keeps P2 constant for a duration of t; Among them, P2=25kW~45kW.
[0108] And, when melting in step 203, the process is as follows:
[0109] Step 1, heat preservation: control the heating temperature of the polysilicon ingot casting furnace at T1, and keep heat for 0.4h to 0.6h;
[0110] Step 2 to Step 5, heating and pressurization: gradually increase the heating temperature of the polysilicon ingot furnace from T1 to T6 in four steps from first to last, and the heating time is 0.4h to 0.6h; The polysilicon ingot casting furnace is filled with inert gas and the air pressure of the po...
Embodiment 3
[0155] In this example, the difference from Example 2 is: in step 202, the preheating time is 4 hours and T1=1285°C, P1=100kW; in step 203, T2=1560°C, t=20min, P1=45kW, Q2=650mbar ; In the first step, the holding time is 0.4h; in the second step to the fifth step, T6=1325°C, and the heating time is 0.4h; in the sixth step, T7=1460°C, and the heating time is 3.5h; in the seventh step, T8 =1510°C and the heating time is 3.5h; the heating time in the 8th step is 3.5h; the holding time in the 9th step is 3.5h; the holding time in the 10th step is 4h;
[0156] In the present embodiment, when heating up and pressurizing in the 2nd step to the 5th step, the process is as follows:
[0157] The second step, the first step of raising: the heating temperature of the polysilicon ingot casting furnace is raised from 1285°C to 1290°C, and the heating time is 5 minutes.
[0158] The third step and the second step of raising: raise the heating temperature of the polysilicon ingot casting fur...
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