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Lead-free high-temperature antioxidant solder and preparation method thereof

A high-temperature anti-oxidation and solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of imprecise alloy structure, easy cracks in the surfacing layer, poor oxidation resistance, etc., and achieve high temperature resistance Good oxidation performance, smooth and beautiful weld seam, good affinity effect

Active Publication Date: 2017-01-04
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing lead-free solders often have problems such as poor oxidation resistance at high temperatures, excessive welding slag, more bridging defects, poor alloy structure, dull solder joints after welding, and insufficient weld seams during the soldering process. Smooth, easy cracks in the surfacing layer, poor fluidity, easy to cause cusps and bridging after welding, poor appearance of solder joints, etc., have become problems that need to be solved urgently

Method used

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  • Lead-free high-temperature antioxidant solder and preparation method thereof
  • Lead-free high-temperature antioxidant solder and preparation method thereof

Examples

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preparation Embodiment 1

[0022] Preparation Example 1: The lead-free high-temperature anti-oxidation solder and its preparation method provided in this example, the lead-free high-temperature anti-oxidation solder is composed of the following components by weight percentage: 2% silver, 8% copper, 0.04% nickel , indium 0.005%, phosphorus 0.001%, germanium 0.06%, and the balance is tin. First, weigh the raw materials according to the set weight ratio, put the tin into a steel container, place the steel container on an electric furnace, and heat it at 260°C to melt the tin into a liquid state; then put the silver, copper , nickel, indium, phosphorus, and germanium into a steel container, stirred for 25 minutes to fully melt; then add 0.3% ammonium chloride solution accounting for the total mass of solder raw materials into the steel container, deoxidize at high temperature Impurities are removed, wherein the mass fraction of the ammonium chloride solution is 42%; the stirred solder is poured into the mol...

preparation Embodiment 2

[0024] Preparation Example 2: The lead-free high-temperature oxidation-resistant solder provided in this example and its preparation method are basically the same as Example 1, except that:

[0025] The lead-free high-temperature anti-oxidation solder of this embodiment is composed of the following components by weight percentage: 5.0% silver, 5.1% copper, 0.1% nickel, 0.05% indium, 0.15% phosphorus, 0.04% germanium, and the balance is tin. The specific preparation process: heating at 300°C to melt tin into a liquid state; adding silver, copper, nickel, indium, phosphorus, and germanium, and stirring for 28 minutes; After the oxygen is removed, the material is discharged, wherein the mass fraction of the ammonium chloride solution is 38%.

[0026] Others are the same as in Embodiment 1, and will not be redundant here.

preparation Embodiment 3

[0027] Preparation Example 3: The lead-free high-temperature oxidation-resistant solder provided in this example and its preparation method are basically the same as in Example 1, except that:

[0028] The lead-free high-temperature anti-oxidation solder of this embodiment is composed of the following components by weight percentage: 0.001% silver, 11% copper, 0.05% nickel, 0.1% indium, 0.06% phosphorus, 0.08% germanium, and the balance is tin. The specific preparation process: heat at 360°C to melt tin into a liquid state; add silver, copper, nickel, indium, phosphorus, and germanium, and stir for 30 minutes; add ammonium chloride solution whose weight accounts for 0.4% of the total mass of solder raw materials After the oxygen is removed, the material is discharged, wherein the mass fraction of the ammonium chloride solution is 40%.

[0029] Others are the same as in Embodiment 1, and will not be redundant here.

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Abstract

The invention discloses lead-free high-temperature antioxidant solder. The solder is prepared from the following ingredients by weight percent: 0.001 to 5.0% of silver, 0.001 to 11% of copper, 0.001 to 0.1% of nickel, 0.001 to 0.1% of indium, 0.001 to 0.15% of phosphorus, 0.001 to 0.08% of germanium and the balance of tin. The invention further provides a preparation method of the lead-free high-temperature antioxidant solder. Compared with the prior art, the lead-free high-temperature antioxidant solder can generate little oxidizing slag at high temperature (250 DEG C to 510 DEG C) soldering and can keep the surface of a solder machine bright and free of oxidation at the temperature. The solder can't be oxidized for 50 seconds at the temperature of 500 DEG C, so that the soldering efficiency is greatly improved and the high temperature oxidization resistance is excellent. In soldering, the solder has fewer soldering defects compared with an ordinary Sn-Ag-Cu system, the surface of a solder joint is bright, the solder joint is full, continuous soldering is avoided, and the soldering quality is effectively improved. The solder is environmentally friendly and safe.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a lead-free high-temperature anti-oxidation solder whose components do not contain lead and has good oxidation resistance under high-temperature soldering conditions and a preparation method thereof. Background technique [0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering performance, lead is a toxic substance. After entering the human body, it accumulates in the bones and is not easily discharged, causing lead poisoning of operators. Therefore, Japan, the European Union and the United States have successively formulated their own lead-free solder schedules and standards, and Japanese companies have begun to use lead-free solder in their electronic products. Many enterprises in our country have received notices from corresponding exporting countries, setting a timetable for realizin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 叶桥生黄守友黄义荣林成在曹建平黄信元袁小刚
Owner THOUSAND ISLAND METAL FOIL
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