a solder paste
A solder paste and solder powder technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of appearance, halogen residual appearance, temperature difference, etc., to reduce the amount of residual after welding, solder joints Transparent and beautiful appearance
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Embodiment 1
[0026] Example 1 Solder Paste Components
[0027] Solder paste components include: alloy SAC305 (Sn96.5, Ag3.0, Cu0.5), powder diameter 20-38μm (T4), or powder diameter 25-45μm (T3), according to weight percentage: spherical solder powder 88.5%, flux 11.5%,
[0028] Among them, 11.5% of the flux contains by weight: 40% of polymerized rosin, 4.5% of acrylic modified rosin, 28% of diethylene glycol monohexyl ether, 12% of 2-ethyl-1,3-hexanediol , 5% thixotropic agent (composed of 2% beeswax, 3% stearic acid amide), 2% (4-cyanobenzoic acid), 6% succinic acid, 3% azelaic acid, 2.5% benzotriazole .
[0029] Wherein, the 40% polymerized rosin and 4.5% acrylic acid modified rosin can be replaced with any one of hydrogenated rosin, disproportionated rosin and synthetic resin or a combination thereof.
[0030] Wherein, the combination of 28% diethylene glycol monohexyl ether and 12% 2-ethyl-1,3-hexanediol can be replaced by diethylene glycol octyl ether, diethylene glycol butyl ethe...
Embodiment 2
[0033] Example 2 Solder Paste Components
[0034] The components of the solder paste include: alloy (Sn90 antimony 10, or Sn80 antimony 20), powder diameter 20-38μm (T4) or powder diameter 25-45μm (T3), by weight: spherical solder powder 89%, flux 11%,
[0035] Among them, 11% of flux components include by weight: 35% polymerized rosin, 4.5% acrylic modified rosin, 20% diethylene glycol monohexyl ether, 8% 2-ethyl-1,3-hexanediol , 10% thixotropic agent (composed of 4% beeswax, 6% stearic acid amide), 4% (2% 4-cyanobenzoic acid), 6% phthalic acid, 3% azelaic acid, 2.5% benzene Parallel triazole.
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