Multi-layer overlaid storage disk with same substrate compatible with multiple interfaces, and packaging process thereof

Abstract

The present invention discloses a multi-layer overlaid storage disk with the same substrate compatible with multiple interfaces. According to the storage disk, an interface of the storage disk is replaced with a TypeC high-speed male connector interface, and a packaging structure is changed. A memory, and a processing chip and an electronic element are disposed at an upper layer and a lower layer, so that the whole storage disk is reduced in structure width, and is convenient to carry. Packaging glue is used for filling twice, so that the interior circuit structure is more stable. Wafer layers are of a ladder type and are overlaid, so that a connecting distance between edge connectors is shortened, signal loss is reduced, and the cost is saved. The storage disk has a small structure and is easy to carry. Due to the detection resistor 10-PIN substrate comprising TypeC, the substrate of a fixed resistor is compatible with a USB, a 9-pin male connector, a MicroUSB, an OTG, a TypeC, an iphone connector, a Lighting adapter and so on. The multi-layer overlaid storage disk is compatible with the USB, 9-pin male connector, TypeC, MicroUSB, OTG, and iphone Lighting male connector mounting.

Description

technical field [0001] The invention relates to the technical field of storage disks, in particular to a multi-layer stacked storage disk compatible with multiple interfaces with a substrate and its packaging process. Background technique [0002] With the gradual popularization of electronic products, the manufacturing technology of the memory card used with the product not only has a large increase in storage capacity, but also has a significant improvement in practicality. The card itself provides better compatibility. Make it more convenient for consumers to use in practice. [0003] The storage disk is suitable for a standard USB interface, and the storage disk is provided with a USB gold finger that can be electrically connected to the standard USB interface. In order to protect the USB golden finger, a general storage disk is usually provided with a casing and an outer cover of the sealed casing, and the outer cover can accommodate the USB golden finger therein. Whe...

AI Technical Summary

Problems solved by technology

[0006] 1. The mounting process of the traditional USB Type-C connector is complex, with many assembly processes and high cost;

[0007] 2. The traditional USB Type-C connector has poor compatibility;

[0008] 3. The shielding shell of the traditional USB Type-C connector is welded by bending the hardware, which makes the thickness of the USB Type-C connector thicker, which cannot meet the user's pursuit of smaller and ultra-thin requirements

Traditionally, the signals applied to the stack of memory disk chips flow through wires. Long wires will cause signal delay and occupy more space, resulting in the production of large memory disk chip stacks.

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