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PCB and PCBA

A groove bottom and solder paste technology, which is applied to printed circuits, printed circuits connected with non-printed electrical components, electrical components, etc., can solve problems such as virtual soldering, large amount of solder paste 4', and poor control of the amount , to achieve the effect of ensuring the overall structural strength, improving heat dissipation efficiency, and increasing installation space

Inactive Publication Date: 2018-08-10
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, such a structure has the following disadvantages: since the depth control of the metallization groove has a certain tolerance, and the distance from the pad to the groove wall is usually relatively short, in the process of fixing the component 5', the solder paste 4 The amount of 'is not easy to control. A small amount of solder paste 4' will lead to poor soldering at the bottom of the component 5', resulting in virtual soldering and voids; a large amount of solder paste 4', see figure 2 and image 3 , will cause the excess solder paste 4' to climb rapidly along the metallized groove wall and overflow to the surface layer of PCB 1' to contact the circuit pattern of the non-same network, resulting in a short circuit

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0041] This embodiment provides a PCB 1, including a first groove 2 and a second groove 3, wherein the first groove 2 is a non-metallized groove, which is set on one side of the PCB 1, and the second groove 3 The groove bottom of the first groove 2 is opened, the groove bottom and the groove wall of the second groove 3 are metallized, and the solder paste 4 is arranged in the second groove 3 .

[0042] In this embodiment, the PCB 1 is formed by pressing three core boards, but the number is not limited thereto, for example, two or four core boards can also be formed by pressing together. Before pressing, at least one prepreg is stacked between two adjacent core boards, and the number of prepregs is selected according to the actual pressing situation.

[0043] This embodiment also provides a PCBA (Printed Circuit Board+Assembly), such as Figure 4-Figure 6 As shown, the PCBA includes components 5 and the PCB 1 provided in this embodiment. The components 5 are welded in the seco...

Embodiment 2

[0069] This embodiment provides a PCB 1 , which is basically the same as the first embodiment, and for the sake of brevity, only the differences between this embodiment and the first embodiment will be described. The structure of the first groove 2 in this embodiment is different from the first embodiment.

[0070] Such as Figure 7 As shown, the first groove 2 includes a middle groove 21 and several extension grooves 22, the second groove 3 is set at the groove bottom of the middle groove 21, and the horizontal cross-sectional area of ​​the second groove 3 is smaller than the horizontal cross-sectional area of ​​the middle groove 21 , a number of extension grooves 22 are arranged at intervals around the middle groove 21 and are all connected to the middle groove 21. The opening positions of the extension grooves 22 are selected according to the distribution of the circuit patterns on the surface layer of the PCB. Specifically, the extension grooves 22 avoid The circuit patte...

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Abstract

The invention relates to the technical field of PCB structures, particularly to a PCB and a PCBA. The PCB includes a first concave which is arranged at one side of the PCB and is a non-metalized groove; and a second groove arranged at the bottom of the first groove, the bottom and a wall of the second groove being metalized, and solder paste being arranged in the second groove. The PCBA includes components and the abovementioned PCB, the components are welded in the second groove through solder paste, the solder paste is not higher than a substrate at an opening of the first groove. The non-metalized first groove is arranged in the PCB, thereby providing accommodating space for a small amount of redundant solder paste; a non-metalized groove wall of the first groove can effectively preventa short circuit phenomenon caused by a circumstance that the solder paste is too fast in climbing speed and is easy to spill to a surface layer of the PCB and is connected with circuit patterns of the surface layer; the bottom of the second groove is metalized, surface mounting of the components is facilitated, and heat dissipation efficiency of the components is improved; and the wall of the second groove is metalized, and electric conduction of two layers or multiple layers of circuit patterns inside the PCB can be realized.

Description

technical field [0001] The invention relates to the technical field of PCB structures, in particular to a PCB and a PCBA. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] With the development of electronic product technology, in order to save space, the components on the PCB have been developed from surface mount to embedded mount. For embedded placement of certain components, it is required that the circuit patterns of two layers in the mounting area are disconnected (different networks), while the circuit patterns of certain two laye...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18H05K3/34
CPCH05K1/0204H05K1/183H05K3/3478H05K2201/09036
Inventor 肖璐纪成光杜红兵孙梁傅宝林刘梦茹
Owner DONGGUAN SHENGYI ELECTRONICS
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