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Online measurement method and measurement apparatus of residual stress of conductive thin film material

A technology of residual stress and conductive film, which is applied in the direction of measuring devices, force/torque/work measuring instruments, and analytical materials, etc.

Active Publication Date: 2016-12-21
SOUTHEAST UNIV
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Problems solved by technology

However, the measurement structure is usually only designed for the state of tensile stress or only for the state of compressive stress, and it cannot be measured under the condition of unknown material parameters, unknown residual stress and positive or negative (tensile stress or compressive stress)

Method used

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  • Online measurement method and measurement apparatus of residual stress of conductive thin film material
  • Online measurement method and measurement apparatus of residual stress of conductive thin film material
  • Online measurement method and measurement apparatus of residual stress of conductive thin film material

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Embodiment Construction

[0039] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0040] figure 1 It is a schematic diagram of the structure of the measurement device of the present invention, which is composed of two double-end fixed beam measurement units made of polysilicon material, which are respectively the first measurement unit and the second measurement structure unit; the first measurement unit consists of The first driving electrode 103-1, the first measuring piece 104-1, and three anchor regions are composed of three anchor regions. Metal electrodes are respectively set on the three anchor regions. Here, the three anchor regions are respectively marked as C, A, and A' ; The first drive electrode 103-1 is T-shaped, and the three ancho...

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Abstract

The invention brings forward an online measurement method of residual stress of a conductive thin film material, and a corresponding measurement apparatus. A measurement structure is designed by use of an electrostatic driving Pull-in principle, relevance of parameters of two measurement members is controlled through use of synchronous processing control, through limiting correlation parameters of total strain energy of the two measurement members, a partial differential equation set of the total strain energy is constrained accordingly, and values of unknown residual stress sigma 0 and a Young's modulus E of the two measurement members are obtained through a mode of solving the partial differential equation set. According to the invention, the problem of incapability of real-time measurement of the conductive thin film material under the condition of unknown material parameters, unknown residual stress size and unknown positivity and negativity (tensile stress or compression stress) is solved. The apparatus and method have the advantages of simple measurement structure, simple electric signal loading and measurement, stable calculation method and high measurement efficiency.

Description

technical field [0001] The invention relates to the field of online measurement of conductive thin films, in particular to the field of online measurement of residual stress of conductive thin film materials. Background technique [0002] The performance of microelectromechanical devices is closely related to the physical parameters of materials, and the physical parameters of materials for manufacturing microelectromechanical devices are related to the manufacturing process. That is, the manufacturing process of the material is different, and its physical parameters will also be different. The purpose of online measurement is to measure the physical parameters of MEMS materials manufactured by specific processes in real time. [0003] The basic materials of MEMS device structures are usually thin film materials, usually prepared by chemical vapor deposition (CVD) method. Residual stress is an important physical parameter of materials and has a significant impact on the pe...

Claims

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Application Information

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IPC IPC(8): G01L5/00G01N3/08
CPCG01L5/00G01N3/08G01L5/0047G01N2203/0075
Inventor 顾一帆周再发黄庆安李伟华
Owner SOUTHEAST UNIV
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