A method for processing semi-circular holes in high volume fraction SiC-Al matrix composites

Abstract

The invention discloses a method for machining semi-circular holes in silicon carbide-aluminum-based composite materials with high volume fractions. The method comprises steps as follows: a workpiece blank is ground with a grinding wheel, a ground workpiece is placed in a tool positioning groove to be fastened, the front side of the workpiece is milled with a PCD milling cutter, two through hole bosses and two semi-circular hole bosses are reserved on four corners of the front side of the workpiece, through holes are machined in the through hole bosses with PCD coated drills, the semi-circular holes are machined in the semi-circular hole bosses with milling rods, the machined workpiece is taken out of a positioning tool, and the workpiece and the tool positioning groove are cleaned. With the technical scheme, problems of large machining difficulty, high rejection rate, low machining efficiency and poor precision during precision machining of the semi-circular holes in the hard and brittle silicon carbide-aluminum-based composite materials with the high volume fractions are well solved, high-precision size machining of the semi-circular holes in parts made of the materials is realized, the machining cost is low, the yield is high, the flexibility is high, and the method is suitable for batch production and has very high practicability.

Description

technical field [0001] The invention relates to a processing method, in particular to a method for processing a semicircular hole in a high volume fraction silicon carbide aluminum matrix composite material. Background technique [0002] With the rapid development of microwave technology, more stringent requirements are put forward for the design of microwave devices. It is required that the product size is continuously reduced and the assembly density is continuously increased. As a key structural part in the T / R assembly, the T / R assembly carrier board must be made of materials with excellent electrical and thermal conductivity, and must have sufficient strength in terms of mechanical properties; In terms of thermal performance, it should have good heat resistance and thermal conductivity, and the coefficient of thermal expansion should match the assembly material and semiconductor chip, so it can only be prepared by high volume fraction silicon carbide aluminum matrix com...

AI Technical Summary

Problems solved by technology

[0004] At present, only coated drills can be used to process through holes on silicon carbide aluminum matrix composite materials, while semicircular holes can only be processed by wire cutting. Since silicon carbide aluminum matrix composite materials contain a large number of non-conductive silicon carbide particles, resulting in The wire is often broken during wire cutting, the efficiency is extremely low, and the processing accuracy is very poor

Therefore, using the current processing methods, it is impossible to complete the precision machining of semicircular holes in high volume fraction silicon carbide aluminum matrix composite materials with high quality and high efficiency.

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