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Method for connecting TiNi SMA with titanium or titanium alloy through nano multilayer film self-propagating reaction

A nano-multilayer, self-propagating technology, used in welding equipment, metal processing equipment, welding/welding/cutting items, etc., can solve the problems of harsh external auxiliary equipment, inability to form large-area connections, and limited heating temperature. Achieve the effect of saving connection time, wide range of use and fast burning speed

Active Publication Date: 2016-12-21
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the problem that the conventional welding method cannot form a large-area connection due to the limited heating temperature and the need for harsh conditions of external auxiliary equipment, and provides a method for connecting TiNi SMA and titanium or titanium alloys using nano-multilayer film self-propagating reaction

Method used

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  • Method for connecting TiNi SMA with titanium or titanium alloy through nano multilayer film self-propagating reaction

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specific Embodiment approach 1

[0012] Specific implementation mode 1: In this implementation mode, a method for connecting TiNiSMA and titanium or titanium alloys using a self-propagating reaction of a nano-multilayer film is specifically completed according to the following steps:

[0013] One, prepare active nano film: Alternately sputter titanium and nickel with magnetron sputtering machine, titanium layer monolayer thickness 25nm-100nm, nickel layer monolayer thickness 25nm-50nm, the thickness ratio of nickel layer and titanium layer is (1- 3): 2, Alternate sputtering for 80-120 cycles, the final total film thickness is 4μm-15μm, secret storage;

[0014] 2. Surface treatment: use #400 sandpaper, #600 sandpaper and #800 sandpaper to polish the TiNi SMA surface and the metal surface layer by layer until the surface is smooth and flat, and obtain the TiNi SMA and metal with surface pretreatment. The polished TiNi SMA, Put 2 SnAgCu solder foils and metals with a thickness of 30-70μm into alcohol and ultraso...

specific Embodiment approach 2

[0018] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the thickness ratio of nickel layer and titanium layer described in step 1 is 100 cycles, and the final total film thickness is 5-15 μm, and it is sealed and stored. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0019] Specific embodiment 3: The difference between this embodiment and one of specific embodiments 1 to 2 is that the thickness ratio of nickel layer and titanium layer described in step 1 is 100 cycles, and the final total film thickness is 5-15 μm. Keep airtight. Others are the same as one of the specific embodiments 1 to 2.

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Abstract

Disclose is a method for connecting titanium-nickel SMA (shape memory alloy) with titanium or TC4 through self-propagating reaction. The method comprises the steps that 1, an active nano thin film is prepared, specifically, a magnetron sputtering machine is used for conducting alternative sputtering of titanium and nickel, finally the total thickness of the thin film is 4 [mu]m-15 [mu]m, and sealing storage is conducted; 2, surface treatment is conducted, specifically, the polished TiNiSMA, two SnAgCu brazing filler metal foil pieces with the thickness of 30-70 [mu]m and metal are put into ethyl alcohol for ultrasonic cleaning and then dried, and the metal is the titanium or the TC4; and 3, ignition is conducted, specifically, the TiNiSMA, one SnAgCu brazing filler metal foil piece, the active nano thin film, the other SnAgCu brazing filler metal foil piece and the metal are overlapped sequentially, then ignition is conducted under the pressure of 2 MPa-7 MPa, and connection of the TiNiSMA with the metal titanium or the TC4 material is completed though heat emitted by the active nano multilayer film. According to the method, the speed, the connector strength and the efficiency are high, integral heating is not needed, a heat affected zone is small, and the performance of the two materials is not influenced.

Description

technical field [0001] The invention relates to a method for connecting TiNi SMA and titanium or titanium alloy by self-propagating reaction of nanometer multilayer film, which belongs to the field of material connection. Background technique [0002] Shape memory alloy (SMA), as an important smart material, has been widely used in manufacturing, medical and aerospace fields. TiNiSMA sheets are installed on the titanium alloy tail nozzle interlocking sheet for aero-engines to make a driver that can control aerodynamics and reduce engine noise. However, there are few studies on the connection between TiNi SMA and titanium alloy. [0003] The structure of TiNi SMA and titanium is very different, and the thermal expansion coefficient is very different. During the heating and cooling process of the connection, the expansion and contraction of the two are very different, which will lead to a large thermal stress on the joint interface. have a greater impact on subsequent applic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/19B23K1/20B23K103/18
CPCB23K1/19B23K1/20B23K1/206
Inventor 李红杨林派胡安明马颖乔巧
Owner BEIJING UNIV OF TECH
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