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Surface modification method for diamond micropowder for ultra-fine diamond wire saw

A technology of diamond micropowder and diamond wire saw, which is applied in the direction of coating, electrolytic coating, etc., can solve the problems of poor dispersion performance, uneven wire diameter, poor activation effect, etc., achieve fast plating adhesion and improve hydrophilicity , the effect of preventing pollution

Active Publication Date: 2016-12-14
山东山田新材科研有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing modification treatment method has poor effect, poor activation effect, poor dispersion performance, easy accumulation and superposition, resulting in uneven wire diameter, and easy to cause cut marks when cutting and using

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The method for modifying the surface of diamond micropowder for ultra-fine diamond wire saw comprises the following steps:

[0023] (1) Calcining the diamond micropowder after electroless plating at 200°C for 2 hours;

[0024] (2) The calcined diamond powder is acid-washed and activated with a compound acid whose mass concentration is respectively 1% of sulfuric acid and citric acid, and the drum is stirred for 3 minutes, and deacidified by filtration after activation;

[0025] (3) Alkane sulfonate cationic surfactant and deionized water are mixed according to the mass ratio of 1:1000, then add the diamond micropowder after deacidification and stir, and disperse;

[0026] (4) After dispersing, add the diamond micropowder together with the cationic surfactant into the electroplating solution, stir and disperse evenly, and set aside.

Embodiment 2

[0028] The method for modifying the surface of diamond micropowder for ultra-fine diamond wire saw comprises the following steps:

[0029] (1) Calcining the diamond micropowder after electroless plating for 1.5 hours at 250°C;

[0030] (2) The calcined diamond powder is acid-washed and activated with a compound acid whose mass concentration is respectively 5% sulfuric acid and citric acid, and the drum is stirred for 5 minutes, and deacidified by filtration after activation;

[0031] (3) Alkane sulfonate cationic surfactant and deionized water are mixed according to the mass ratio of 5:1000, then add the diamond micropowder after deacidification and stir, and disperse;

[0032] (4) After dispersing, add the diamond micropowder together with the cationic surfactant into the electroplating solution, stir and disperse evenly, and set aside.

Embodiment 3

[0034] The method for modifying the surface of diamond micropowder for ultra-fine diamond wire saw comprises the following steps:

[0035] (1) Calcining the diamond micropowder after electroless plating at 300° C. for 1 hour;

[0036] (2) The calcined diamond micropowder is acid-washed and activated with a compound acid whose mass concentration is respectively 3% sulfuric acid and citric acid, and the drum is stirred for 4 minutes, and deacidified by filtration after activation;

[0037] (3) Alkane sulfonate cationic surfactant and deionized water are mixed according to the mass ratio of 2:1000, then add the diamond micropowder after deacidification and stir, and disperse;

[0038] (4) After dispersing, add the diamond micropowder together with the cationic surfactant into the electroplating solution, stir and disperse evenly, and set aside.

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PUM

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Abstract

The invention discloses a surface modification method for diamond micropowder for an ultra-fine diamond wire saw and belongs to the technical field of diamond micropowder production. By the adoption of the surface modification method for the diamond micropowder for the ultra-fine diamond wire saw, the problems that in the prior art, diamond micropowder is poor in dispersity and prone to accumulation and agglomeration are solved. The surface modification method comprises the following steps that (1) the diamond micropowder subjected to chemical plating is calcinated; (2) the calcinated diamond micropowder is pickled for activation through composite acid, and filtration and deacidification are conducted after activation; (3) dispersing treatment is conducted on the deacidified diamond micropowder through a cationic surface active agent; and (4) the dispersed diamond micropowder and the cationic surface active agent are added into electroplate liquid and evenly stirred and dispersed for later use. The surface modification method is suitable for surface modification of the diamond micropowder for the ultra-fine diamond wire saw.

Description

technical field [0001] The invention relates to a method for surface modification of diamond micropowder for ultrafine diamond wire saws, and belongs to the technical field of diamond micropowder production. Background technique [0002] Diamond wire saw is a cutting tool made by firmly holding high-hardness, high-wear-resistance diamond abrasive grains on the steel wire substrate by electroplating. Electroplated diamond wire saw has the advantages of high cutting efficiency, small sawing force, neat saw kerf, smooth cut surface, high material yield, low noise, and little environmental pollution. It is not only suitable for processing ordinary hard and brittle materials such as stone and glass, And it is especially suitable for sawing precious hard and brittle materials such as ceramics, gemstones, and crystals. [0003] In order to improve the dispersibility of diamond micropowder and the adhesion on the metal wire, it is generally necessary to modify the diamond micropowd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00
CPCC25D15/00
Inventor 杜彬龚志刚周强张久勇班彦丁郝文虎
Owner 山东山田新材科研有限公司
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