Hybrid film and preparation method for the same, and flexible OLED displayer

Abstract

The invention discloses a hybrid thin film and a preparation method thereof, as well as a flexible OLED display, wherein the hybrid thin film includes a plurality of composite unit layers superimposed on each other, and the composite unit layer includes a first inorganic layer stacked in sequence, An organic layer and a second inorganic layer. The bending radii of the organic layer and the inorganic layer are different, and the degree of degradation of the water-blocking properties of the packaging layer is different with different bending radii. The present invention effectively improves the flexibility of the packaging layer by increasing the number of inorganic / organic interfaces, increasing the interface to delay the intrusion of water and oxygen, and improving the overall performance. The encapsulation effect of the structure; compared with the Vitex structure, the present invention has a lower thickness of the overall film layer, and a stronger ability to block water and vapor on the side of the film. In addition, the organic layer has a weaker ability to block water and vapor, and the use of two layers of inorganic layers to coat the organic layer can further improve Water vapor blocking effect.

Description

Technical field [0001] The invention relates to an OLED film, in particular to a hybrid film applied to a flexible OLED, a preparation method thereof, and a flexible OLED display. Background technique [0002] At present, Thin Film Encapsulation (Thin Film Encapsulation) of Organic Light Emitting Diode (OLED for short) mostly adopts inorganic / organic multilayer stacked structure. Analysis has found that with a fixed thickness, increasing the number of stacking can effectively increase the resistance. The effect of water and oxygen, that is, the thickness of the single layer decreases and the interface increases, which increases the path of water and oxygen diffusion and prolongs the time of water and oxygen intrusion; when the thickness of the inorganic layer increases, the internal stress and defect density of the film increase, thus weakening To improve the packaging performance, the increase of the organic layer releases the stress of the inorganic film layer on the one hand, ...

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Problems solved by technology

[0005] The above-mentioned thin-film packaging structure has the following problems: 1. Inorganic / organic multi-layer stacking, the thickness is too large, such as Vitex reaches several microns, which not only reduces the light extraction efficiency of the device, but also weakens the adhesion performance of the film layer if the film thickness is too large , there is a risk of de-filming. On the other hand, a thicker organic layer has very limited water and oxygen blocking effect, while the defects and stress of an excessively thick inorganic layer are greatly increased. Therefore, in order to obtain better water blocking properties, it is difficult to reduce the stacking times and thickness. ; 2. Generally, the inorganic layer and the organic layer use different reactants and are carried out in different chambers. For example, the organic layer of Vitex needs to be cured, and the inorganic and organic layers are alternately carried out, which greatly increases the process time and improves the quantity. 3. The film-forming method of the inorganic layer is PECVD or sputtering. These film-forming methods may destroy the OLED device due to the bombardment of the plasma, form dark spots or even cause the device to fail to light up, which reduces the life and quality of the product. Rate

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