Flat bump type non-metal cutting package process and package structure thereof

Abstract

The invention discloses a flat bump type non-metal cutting package process and a package structure thereof, and belongs to the field of semiconductor manufacturing. The flat bump type non-metal cutting package process comprises the following steps: (1) taking a metal substrate; (2) sticking dry film layers on the front surface and the back surface of the metal substrate respectively; (3) removing part of the dry film layer; (4) plating the front surface of a base bump, connection rib and pin region formed on the metal substrate with a front surface metal layer, and plating connection ribs with silver; (5) removing the dry film layers to expose etching regions; (6) performing half etching to form sunken half-etched regions on the metal substrate, and forming base bumps and pins; (7) embedding chips; (8) performing wiring; (9) performing package and post-curing; (10) sticking the dry film layers again; (11) removing the dry film layers from the metal substrate; (12) performing full etching on the region, which is not covered by dry film, on the back surface of the metal substrate to enable the base bumps and the pins to be protruded out of the surface of a plastic package body; (13) removing the dry film layers; (14) forming pin metal layers; (15) performing cutting. The flat bump type non-metal cutting package process achieves the advantages of high reliability and low tool wear.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, more specifically, to a planar bump type metal-free cutting packaging process and its packaging structure. Background technique [0002] For decades, integrated circuit packaging technology has been following the development of integrated circuits, and people have been looking for the best balance between small size and high performance. From the DIP plug-in package in the 1970s to the SOP surface mount package, and then to the QFP flat chip package in the 1980s, the package volume of the chip has been developing towards miniaturization, and the structural performance has been continuously improved. In the 1990s, the QFN four-sided flat package appeared, based on the QFP, the output pins around the package body were retracted to the bottom of the package body, thereby greatly reducing the occupied space during the placement operation. However, QFN often has problems such as unstable in...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of easy delamination, poor reliability, and fast tool wear in the existing technology, the present invention provides a planar bump type metal-free cutting packaging process and its packaging structure

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