Pressure ring assembly and semiconductor processing equipment

Abstract

The invention provides a pressure ring assembly and semiconductor processing equipment. The pressure ring assembly is used for cooperating with a base carrying a substrate in use, and comprises a pressure ring, a supporting member used for supporting the pressure ring, and an elastic component, wherein the pressure ring is used for laminating an edge region of the upper surface of the substrate, so as to fix the substrate; and the elastic component is fixed between the pressure ring and the supporting member, and a downward elastic force applied to the pressure ring is realized through stretching the elastic component when the substrate is fixed by the pressure ring. The pressure ring assembly provided by the invention does not need to satisfy a backpressure requirement through limiting the pressure ring to adopt heavy materials, nor to satisfy a backpressure requirement through increasing balance weight additionally, thus the pressure ring material can be extent to light metal or non-metallic materials so as to satisfy the requirements of different processes, thereby improving the applicability of the semiconductor processing equipment.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a pressure ring assembly and semiconductor processing equipment. Background technique [0002] Magnetron sputtering, also known as physical vapor deposition (Physical Vapor Deposition, PVD for short), is a thin film deposition technology widely used at present. At present, Through Silicon Via (TSV for short) technology is a key technology for realizing three-dimensional integration, and PVD is mainly used for depositing a barrier layer and a copper seed layer in the TSV technology in the TSV technology. [0003] It should be noted that PVD usually uses an electrostatic chuck to fix the substrate. However, due to the large thickness of the film deposited in TSV technology, the large film stress will cause the electrostatic chuck to fail to fix the substrate through electrostatic adsorption; in addition, due to the TSV The technology is mostly used i...

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Problems solved by technology

[0004] However, in practical applications, the following problems will inevitably exist in the above-mentioned physical vapor deposition equipment: in order to ensure the cooling effect of the substrate S, the back blowing gas between the substrate S and the susceptor 11 should be guaranteed to have a certain pressure (referred to as back pressure), and the weight of the pressure ring 12 needs to be greater than a certain range to meet the back pressure requirements. Therefore, the pressure ring 12 generally needs to be made of a heavier material. If the pressure ring 12 is made of a lighter material, an additional The counterweight can meet the requirements

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