Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermal-insulation device for PC thermal-insulation embedded column of residence building and PC thermal-insulation embedded column

A technology of thermal insulation device and hidden column, applied in thermal insulation, building components, columns, etc., can solve problems such as poor thermal insulation

Active Publication Date: 2016-11-16
苏州良浦节能新材料股份有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a thermal insulation device and a PC thermal insulation concealed column for building residential buildings, aiming to solve the problem of poor thermal insulation in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal-insulation device for PC thermal-insulation embedded column of residence building and PC thermal-insulation embedded column
  • Thermal-insulation device for PC thermal-insulation embedded column of residence building and PC thermal-insulation embedded column
  • Thermal-insulation device for PC thermal-insulation embedded column of residence building and PC thermal-insulation embedded column

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0025] The embodiment of the thermal insulation device of the PC thermal insulation concealed column of the building house:

[0026] see Figure 1 to Figure 5 , the figure shows the thermal insulation device of the building house PC thermal insulation concealed column provided by the embodiment of the present invention. The heat preservation device includes: a first heat preservation block group 1 and a second heat preservation bl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a thermal-insulation device for a PC thermal-insulation embedded column of a residence building. The thermal-insulation device comprises a first thermal-insulation block set, a second thermal-insulation block set and a third thermal-insulation block, wherein the first thermal-insulation block set and the second thermal-insulation block set are symmetrically arranged with an included angle. The first thermal-insulation block set comprises a plurality of overlaid first thermal-insulation blocks, and the second thermal-insulation block set comprises a plurality of overlaid second thermal-insulation blocks. The third thermal-insulation block is arranged between the first thermal-insulation block set and the second thermal-insulation block set and provided with a first inclined face and a second inclined face symmetrical with the first inclined face. The first inclined face is fixedly connected with the first thermal-insulation block set, the second inclined face is fixedly connected with the second thermal-insulation block set, and the third thermal-insulation block is further internally provided with a cavity. Meanwhile, the invention provides the PC thermal-insulation embedded column. Compared with the prior art, the thermal-insulation device for the PC thermal-insulation embedded column of the residence building and the PC thermal-insulation embedded column have more excellent thermal insulation performance.

Description

technical field [0001] The invention relates to a thermal insulation device for a building and a residence, in particular to a thermal insulation device for a PC thermal insulation concealed column and a PC thermal insulation concealed column for a residential building. Background technique [0002] In modern residential buildings, the trend of modular installation has been gradually developed. This kind of modular installation, as the name suggests, is to manufacture various modules in the house in the factory, such as bay windows, columns, walls, etc., and then transport them to the site for combined installation, which greatly shortens the construction time of the building. The PC used in these modules is concrete prefabricated parts, also called precast concrete. In the current production of each module, various requirements for stability, heat preservation and practicality need to be met. Among them, practicability is easy to achieve, but for thermal insulation, the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/78E04C3/34
CPCE04B1/78E04C3/34
Inventor 朱卫民朱欢劼周孝华陆彬王建王聿暐
Owner 苏州良浦节能新材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com